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IC封装资料_电感_SWPA6028S1R5MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1213831.32 MB22页154
IC封装资料_电容_CL03A105MO3NRNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-12527.46 MB84页206
IC封装资料_电感_SWPA6028S1R0NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1212681.32 MB22页173
IC封装资料_电源管理芯片_LTC3854IMSE_TRPBF.pdf
LTC385413854fbTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONSmallFootprint,WideVINRangeSynchronousStep-DownDC/DCControllerTheLT...
2024-12-12328617.46 KB28页278
IC封装资料_电感_SWPA3012S330MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-122571.32 MB22页90
IC封装资料_电源管理芯片_LTC3854IDDB_TRPBF.pdf
LTC385413854fbTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONSmallFootprint,WideVINRangeSynchronousStep-DownDC/DCControllerTheLT...
2024-12-121121617.46 KB28页135
IC封装资料_电源管理芯片_LTC3110EUF_TRPBF.pdf
LTC31101RevCFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONFEATURESDESCRIPTION2ABidirectionalBuck-BoostDC/DCReg...
2024-12-121146634.55 KB36页277
IC封装资料_电容_0603N101J251CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-127441.26 MB20页133
IC封装资料_电容_GRM033R71C102KA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1252610.43 MB296页26
IC封装资料_电感_SWPA3012S470MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1214281.32 MB22页29
IC封装资料_连接器_1757365.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1265336.13 MB445页48
IC封装资料_电容_CL10A106KQ8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A106KQ8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121872361.1 KB3页116
IC封装资料_电容_CL10A106KQ8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121950259.58 KB3页291
IC封装资料_电容_0805B182K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126091.05 MB27页233
IC封装资料_电感_SWPA6028S2R2NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-128891.32 MB22页56
IC封装资料_电源管理芯片_LTC3855EUJ_TRPBF.pdf
LTC38553855fTypicalapplicaTionDescripTionDual,MultiphaseSynchronousDC/DCControllerwithDifferentialRemoteSenseTheLTC®3855isadualPo...
2024-12-1219122.16 MB44页182
IC封装资料_电容_CL10A106KQ8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A106KQ8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-1216191.42 MB36页77
IC封装资料_电源管理芯片_LTC3111EMSE_PBF.pdf
LTC311113111faFormoreinformationwww.linear.com/LTC3111LOADCURRENT(A)0.000170EFFICIENCY(%)80901000.0011100.010.13111TA01b60504030VI...
2024-12-12307585.65 KB32页15
IC封装资料_电容_0805B183K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214361.05 MB27页120
IC封装资料_电容_0603N101J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1217011.26 MB20页125

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