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IC封装资料_电容_CL03C3R3CA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-1214941.4 MB36页166
IC封装资料_电容_0603N680J101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1216261.26 MB20页198
IC封装资料_电感_SWPA4018S470MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-121501.32 MB22页225
IC封装资料_电源管理芯片_LTC3407AEDD-2_TRPBF.pdf
LTC3407A-213407a2f■HighEfficiency:Upto95%■LowRipple(<35mVPK-PK)BurstModeOperation;IQ=40μA■2.25MHzConstantFrequencyOperation■N...
2024-12-12258358.76 KB16页120
IC封装资料_电源管理芯片_LTC3407AEDD_TRPBF.pdf
LTC3407A13407afaTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONDualSynchronous600mA,1.5MHzStep-DownDC/DCRegulatorTheLTC®3407Ais...
2024-12-121026371.74 KB16页199
IC封装资料_电容_0603N680J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210181.26 MB20页232
IC封装资料_电感_SWPA4018S680MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1212491.32 MB22页157
IC封装资料_电容_GRM21BR71H104KA01L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12138110.43 MB296页28
IC封装资料_电源管理芯片_LTC4001EUF_TRPBF.pdf
1LTC40014001f■HandheldBattery-PoweredDevices■HandheldComputers■ChargingDocksandCradles■DigitalCameras■SmartPhones2ASingleCell...
2024-12-12435308.83 KB20页214
IC封装资料_电容_0603N681J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-127301.26 MB20页89
IC封装资料_电源管理芯片_LTC4001EUF_PBF.pdf
1LTC40014001f■HandheldBattery-PoweredDevices■HandheldComputers■ChargingDocksandCradles■DigitalCameras■SmartPhones2ASingleCell...
2024-12-121661308.83 KB20页273
IC封装资料_电容_GRM155R60J224KE01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121126920.26 KB29页239
IC封装资料_连接器_1757488.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comFeb25,2010ExtractfromtheonlinecatalogMSTBA2,5/3-GOrderNo.:1757488Thefiguresh...
2024-12-121447230.37 KB5页110
IC封装资料_连接器_1757475.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comFeb25,2010ExtractfromtheonlinecatalogMSTBA2,5/2-GOrderNo.:1757475Thefiguresh...
2024-12-121062228.93 KB5页58
IC封装资料_电源管理芯片_LTC3407EDD-2_TRPBF.pdf
LTC3407-2134072fcL,LT,LTC,LTM,BurstMode,LinearTechnologyandtheLinearlogoareregisteredtrademarksofLinearTechnologyCorporation.Allot...
2024-12-121410341.53 KB16页195
IC封装资料_电容_CL10A225KQ8NNWC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KQ8NNWC·Product:Multi-layerCeramicCapacitor...
2024-12-126881.45 MB36页131
IC封装资料_电源管理芯片_LTC3407AEMSE-2_TRPBF.pdf
LTC3407A-213407a2f■HighEfficiency:Upto95%■LowRipple(<35mVPK-PK)BurstModeOperation;IQ=40μA■2.25MHzConstantFrequencyOperation■N...
2024-12-12840358.76 KB16页262
IC封装资料_电容_0805B225K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219531.05 MB27页66
IC封装资料_电容_CL03C010BB3GNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1217097.46 MB84页155
IC封装资料_电容_0805B225K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216651.05 MB27页119

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