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IC资料

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IC封装资料_电容_GRM1555C1H120GA01D.pdf
GRM1555C1H120GA01_(0402,C0G:EIA,12pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-12988944.26 KB30页215
IC封装资料_电容_CL10C431JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12324259.58 KB3页180
IC封装资料_电容_CL10C430JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12507259.58 KB3页130
IC封装资料_电容_CL10C391KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12150316.5 KB3页176
IC封装资料_电容_C0805C103K5RACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-128241.48 MB25页14
IC封装资料_电容_C0805C102K5RACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-125331.48 MB25页272
IC封装资料_电阻_A09-102JP.pdf
81BRIEFINTRODUCTIONORDERCONSTRUCTIONANDDIMENSIONSRoHSMiniature,highdensityassembly.Stableelectricalcapability,highreliability.Comb...
2024-12-1210681.09 MB5页115
IC封装资料_电容_GRM1555C1H120JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12233920.26 KB29页84
IC封装资料_电容_CL10C470FB81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12541259.58 KB3页278
IC封装资料_电容_CL10C470FB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12110316.19 KB3页242
IC封装资料_电容_C0805C104J8RACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-1210631.48 MB25页159
IC封装资料_电源管理芯片_LTC4099EUDC_PBF.pdf
LTC40994099fdnMediaPlayersnPortableNavigationDevicesnSmartPhonesnIndustrialHandheldsnPortableMedicalInstrumentsnSwitchingRegulator...
2024-12-12671624.38 KB36页192
IC封装资料_电阻_A09-103JP.pdf
81BRIEFINTRODUCTIONORDERCONSTRUCTIONANDDIMENSIONSRoHSMiniature,highdensityassembly.Stableelectricalcapability,highreliability.Comb...
2024-12-124791.09 MB5页299
IC封装资料_电容_CL10C470JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1215901.39 MB36页80
IC封装资料_电源管理芯片_LTC4090EDJC_TRPBF.pdf
LTC4090/LTC4090-514090feFormoreinformationwww.linear.com/LTC4090FEATURESAPPLICATIONSDESCRIPTIONUSBPowerManagerwith2AHighVoltageBat...
2024-12-121031594.61 KB30页283
IC封装资料_电容_CL10C470JB8NCNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121598259.58 KB3页273
IC封装资料_电容_GRM155R61A104KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1254920.26 KB29页163
IC封装资料_电容_CL10C470GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12363316.18 KB3页166
IC封装资料_电容_0805B393K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218361.26 MB20页150
IC封装资料_电容_C0805C471K5RACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-124681.48 MB25页257

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