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IC封装资料_连接器_1827907.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12147136.13 MB445页133
IC封装资料_电源管理芯片_LTC4411ES5_TRMPBF.pdf
LTC441114411faLTC4411SCHOTTKYDIODECONSTANTIONCONSTANTRONCONSTANTVONVFWDFORWARDVOLTAGE(V)LTC4411FO1bSLOPE1/RONSLOPE1/RFWDIOCIMAXIFW...
2024-12-12608235.84 KB8页202
IC封装资料_电源管理芯片_LTC4370IMS_PBF.pdf
LTC437014370fTypicalapplicaTionFeaTuresDescripTionTwo-SupplyDiode-ORCurrentBalancingControllerTheLTC®4370isatwo-supplycurrentshar...
2024-12-121703346.99 KB20页138
IC封装资料_电容_0805B681K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127201.05 MB27页8
IC封装资料_电感_VLS252010ET-1R0N.pdf
June2017INDUCTORSPleaserefertoourWebsiteaboutreplacementinformation.CautionTheproductsinthiscatalogisnotrecommendedtoanewdesignWou...
2024-12-121427309.33 KB9页60
IC封装资料_电感_VLS4012ET-100M.pdf
June2017INDUCTORSPleaserefertoourWebsiteaboutreplacementinformation.CautionTheproductsinthiscatalogisnotrecommendedtoanewdesignWou...
2024-12-1274313.98 KB9页113
IC封装资料_电容_GRM155R61C225ME11D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1252410.43 MB296页143
IC封装资料_电容_CL10B103JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B103JB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12304360.63 KB3页159
IC封装资料_机械式继电器_G6K-2F-Y.pdf
1G6KG6KSurfaceMountingRelaySurfaceMountingRelaywiththeWorld’sSmallestMountingArea•Subminiaturemodelassmallas5.2(H)×6.5(W)×10(L...
2024-12-1218491.72 MB9页254
IC封装资料_电源管理芯片_LTC4412ES6_TRPBF.pdf
LTC441214412fbFormoreinformationwww.linear.com/LTC4412TypicalapplicaTionDescripTionLowLossPowerPath™ControllerinThinSOTTheLTC®44...
2024-12-121475486.18 KB14页219
IC封装资料_机械式继电器_G6K-2F.pdf
1G6KG6KSurfaceMountingRelaySurfaceMountingRelaywiththeWorld’sSmallestMountingArea•Subminiaturemodelassmallas5.2(H)×6.5(W)×10(L...
2024-12-1216981.72 MB9页266
IC封装资料_电源管理芯片_LTC4412ES6_TRMPBF.pdf
LTC441214412fbFormoreinformationwww.linear.com/LTC4412TypicalapplicaTionDescripTionLowLossPowerPath™ControllerinThinSOTTheLTC®44...
2024-12-12689486.18 KB14页278
IC封装资料_电容_CL10B103KA8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12528259.58 KB3页211
IC封装资料_电容_GRM1555C1H360JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12966920.26 KB29页86
IC封装资料_电容_CL10C910JB8NCNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121440259.58 KB3页4
IC封装资料_电容_0805B682K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126921.05 MB27页17
IC封装资料_电容_CL10C821KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12571316.51 KB3页199
IC封装资料_电容_CL10C821JB81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12172259.58 KB3页145
IC封装资料_电感_VLS252010HBX-2R2M-1.pdf
INDUCTORSApril2016��VLS252010HBX-1��VLS252010HBX-1�VLS-HBX-1��更多资料下载请到五八文库wk.58sms.com(...
2024-12-121312309.07 KB9页68
IC封装资料_电源管理芯片_LTC4412HVIS6_TRMPBF.pdf
1LTC4412HVsn4412hv4412hvfsAPPLICATIOSUFEATURESDESCRIPTIOUTYPICALAPPLICATIOU36V,LowLossPowerPathTMControllerinThinSOTIVeryLowLossRe...
2024-12-121808260.58 KB12页198

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