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IC资料

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IC封装资料_电容_GRM155R61E474ME01D.pdf
ChipMultilayerCeramicCapacitorsforGeneralPurposeGRM155R61E474ME01_(0402,X5R(EIA),0.47uF,DC25V)_:PackagingCodeReferenceSheet■Scope...
2024-12-12594885.71 KB30页219
IC封装资料_电容_CL10Y105MR5NJND.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL10Y105MR5NJNDProduct:Multi-layerCeramicCapacitor...
2024-12-12865264.15 KB3页293
IC封装资料_电容_CL10B104KA8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104KA8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218481.45 MB36页4
IC封装资料_电容_CC0201CRNPO9BN4R7.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1215261.22 MB13页70
IC封装资料_电容_0805CG5R6C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214141.05 MB27页55
IC封装资料_连接器_0.5K-DX-30PWB.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121990453.69 KB1页37
IC封装资料_连接器_0.5K-DX-28PWB.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121697453.69 KB1页294
IC封装资料_电感_WPN252012H6R8MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121105624.92 KB9页220
IC封装资料_电容_GRM1555C1HR10WA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12165920.26 KB29页259
IC封装资料_电感_WPN252012H4R7MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121039624.92 KB9页231
IC封装资料_电容_CL10Y474MR5NJND.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL10Y474MR5NJNDProduct:Multi-layerCeramicCapacitor...
2024-12-12792264.27 KB3页129
IC封装资料_电容_CL10Y474MR5NJNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL10Y474MR5NJNCProduct:Multi-layerCeramicCapacitor...
2024-12-121461264.26 KB3页77
IC封装资料_电源管理芯片_LTC6803IG-1_TRPBF.pdf
LTC6803-1/LTC6803-31680313faTYPICALAPPLICATIONFEATURESDESCRIPTIONMulticellBatteryStackMonitorTheLTC®6803isa2ndgeneration,complete...
2024-12-12154504.73 KB40页3
IC封装资料_电容_CC0201CRNPO9BN5R6.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1214321.22 MB13页155
IC封装资料_连接器_0.5K-DX-32PWB.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121000453.69 KB1页96
IC封装资料_电容_0805CG6R0C500N.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129591.05 MB27页235
IC封装资料_连接器_0.5K-DX-40PWB.pdf
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2024-12-121085453.69 KB1页196
IC封装资料_电源管理芯片_LTC6803IG-3_PBF.pdf
LTC6803-1/LTC6803-31680313faTYPICALAPPLICATIONFEATURESDESCRIPTIONMulticellBatteryStackMonitorTheLTC®6803isa2ndgeneration,complete...
2024-12-12744504.73 KB40页221
IC封装资料_连接器_0.5K-DX-36PWB.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12717453.69 KB1页51
IC封装资料_电源管理芯片_LTC6803IG-2_PBF.pdf
LTC6803-2/LTC6803-41680324faTYPICALAPPLICATIONFEATURESDESCRIPTIONMulticellBatteryStackMonitorTheLTC®6803isa2ndgeneration,complete...
2024-12-121941486.53 KB40页38

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