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IC资料

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IC封装资料_电容_GRM1885C1H1R8CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121410944.07 KB30页260
IC封装资料_电容_GRM155R71C104KA88J.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12151710.43 MB296页96
IC封装资料_电容_CC0201MRX5R5BB105.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-125991.22 MB13页145
IC封装资料_连接器_1829219.pdf
https://www.phoenixcontact.com/pi/products/182921904/09/2019Page1/4Feed-throughheader-GMSTBV2,5/8-GF-7,62-1829219Pleasebeinformedt...
2024-12-121216190.55 KB4页124
IC封装资料_连接器_1829206.pdf
https://www.phoenixcontact.com/us/products/182920610/28/2014Page1/5Basestrip-GMSTBV2,5/7-GF-7,62-1829206Pleasebeinformedthatthedat...
2024-12-121385177.77 KB5页145
IC封装资料_电容_GRM1885C1H2R0BA01D.pdf
GRM1885C1H2R0BA01_(0603,C0G:EIA,2pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121518944.09 KB30页276
IC封装资料_电容_CL10B104KO8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104KO8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-126691.45 MB36页40
IC封装资料_电容_CC0201MRX5R5BB474.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-122671.22 MB13页259
IC封装资料_电容_0805CG151J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123011.05 MB27页260
IC封装资料_连接器_1829248.pdf
https://www.phoenixcontact.com/us/products/182924810/28/2014Page1/5Basestrip-GMSTBV2,5/11-GF-7,62-1829248Pleasebeinformedthattheda...
2024-12-12663177.73 KB5页125
IC封装资料_电容_0805CG150J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218221.05 MB27页47
IC封装资料_连接器_1829235.pdf
https://www.phoenixcontact.com/pi/products/182923504/09/2019Page1/4Feed-throughheader-GMSTBV2,5/10-GF-7,62-1829235Pleasebeinformed...
2024-12-121723190.64 KB4页240
IC封装资料_电感_YNR3015-1R5M.pdf
SMDPowerInductors-YNR3015Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12866665.41 KB5页250
IC封装资料_连接器_1829222.pdf
https://www.phoenixcontact.com/us/products/182922210/28/2014Page1/5Basestrip-GMSTBV2,5/9-GF-7,62-1829222Pleasebeinformedthatthedat...
2024-12-12417177.78 KB5页115
IC封装资料_电容_GRM1885C1H2R0CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121624944.07 KB30页280
IC封装资料_电容_CC0402BRNPO9BN1R0.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121769998.46 KB11页95
IC封装资料_电源管理芯片_LTM8025EV_PBF.pdf
LTM80251Rev.DFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION36V,3AStep-DownµMod...
2024-12-122181.47 MB22页231
IC封装资料_电容_CC0201MRX5R6BB224.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-124691.22 MB13页232
IC封装资料_电容_CL10B104KO8NNWC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121757259.58 KB3页54
IC封装资料_连接器_1829251.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comJan25,2011ExtractfromtheonlinecatalogGMSTBV2,5/12-GF-7,62OrderNo.:1829251The...
2024-12-121182238.36 KB5页54

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