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IC资料

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IC封装资料_连接器_1830648.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1236836.13 MB445页300
IC封装资料_电容_0805CG220J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214631.05 MB27页62
IC封装资料_电容_0805CG220J101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215681.05 MB27页132
IC封装资料_电感_YNR4018-1R5M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12755661.38 KB5页55
IC封装资料_电感_YNR4018-1R0M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121129661.38 KB5页16
IC封装资料_电感_YNR3015-680M.pdf
SMDPowerInductors-YNR3015Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121494665.41 KB5页113
IC封装资料_电容_GRM155R71C273KA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1285910.43 MB296页263
IC封装资料_电容_CL10B105KO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1218001.45 MB36页166
IC封装资料_电容_GRM1885C1H4R3BA01D.pdf
GRM1885C1H4R3BA01_(0603,C0G:EIA,4.3pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12298944.11 KB30页252
IC封装资料_电容_CL10B105KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121052259.58 KB3页164
IC封装资料_电容_GRM1885C1H4R0CA01D.pdf
GRM1885C1H4R0CA01_(0603,C0G:EIA,4pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121597944.1 KB30页140
IC封装资料_电容_0805CG221J101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216581.05 MB27页89
IC封装资料_电容_CL21B102KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215821.45 MB36页182
IC封装资料_电容_GRM1885C1H4R3CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121765944.07 KB30页37
IC封装资料_电感_YNR4018-2R2M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121758661.38 KB5页204
IC封装资料_电源管理芯片_MAX6037AAUKADJ+T.pdf
GeneralDescriptionTheMAX6037familyoflow-dropout,micropowervolt-agereferencesofferfixedandadjustableoutputvolt-ageoptionsrangingfro...
2024-12-12374516.59 KB18页276
IC封装资料_电容_CL21B103KBCNNNC.pdf
1.Model:CL21B103KBCNNNC2.DescriptionPartno.Size(inch(mm))Thickness(mm)TemperaturecharateristicsCapacitancevalueCapacitancetoleranc...
2024-12-121579133.38 KB1页112
IC封装资料_电容_CL21B103JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1217361.45 MB36页30
IC封装资料_电容_CL10B105KO8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KO8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-127021.45 MB36页237
IC封装资料_电容_CL21B102KBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210041.45 MB36页88

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