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IC资料

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IC封装资料_电容_CL21B224KAFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-123881.46 MB36页182
IC封装资料_连接器_1830680.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1291236.13 MB445页73
IC封装资料_电感_YNR4030-101M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121909664.95 KB5页60
IC封装资料_电感_YNR4030-100M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121790664.95 KB5页196
IC封装资料_电源管理芯片_MC7915CTG.pdf
©SemiconductorComponentsIndustries,LLC,2013July,2013−Rev.181PublicationOrderNumber:MC7900/DMC7900Series1.0ANegativeVoltageRegula...
2024-12-12766278.94 KB16页174
IC封装资料_电容_GRM155R71E103MA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneralPurposeGRM155R71E103MA01_(0402,X7R(EIA),10000pF,DC25V)_:PackagingCodeReferenceSheet■Scop...
2024-12-121647885.1 KB30页265
IC封装资料_电容_CL10B122KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121280259.58 KB3页186
IC封装资料_电容_CL10B122KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B122KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12494361.44 KB3页51
IC封装资料_电容_0805CG390J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121621.05 MB27页264
IC封装资料_电感_YNR4030-150M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12730664.95 KB5页3
IC封装资料_电容_GRM1885C1H9R0DA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12463944.07 KB30页192
IC封装资料_电容_GRM1885C1H9R0CA01D.pdf
GRM1885C1H9R0CA01_(0603,C0G:EIA,9pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12260944.11 KB30页81
IC封装资料_电源管理芯片_MC33063ADR.pdf
−+QS1.25-VReferenceRegulatorRCTIpkOscillatorQ2Q1SwitchCollector4SwitchEmitterTimingCapacitorGND3218765ComparatorInvertingInputVCC...
2024-12-1211981.47 MB30页3
IC封装资料_电容_CL21B224KOFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B224KOFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-121566361.01 KB3页255
IC封装资料_电容_GRM155R71E104KE14D.pdf
GRM155R71E104KE14_(0402,X7R:EIA,0.1uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121329924.52 KB29页146
IC封装资料_电容_CL21B224KOCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213791.45 MB36页90
IC封装资料_电容_CL10B122KB8WPNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121592452.9 KB21页66
IC封装资料_电容_CC0402CRNPO9BN2R7.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1279217.81 MB176页263
IC封装资料_电容_CL10B122KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121301452.9 KB21页268
IC封装资料_电容_0805CG391J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127631.05 MB27页109

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