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IC封装资料_电容_CL21B333KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-125841.45 MB36页237
IC封装资料_电容_CL21B332KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213351.45 MB36页132
IC封装资料_电容_GRM1885C1H101JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121593944.07 KB30页56
IC封装资料_电容_GRM1885C1H101GA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12479944.07 KB30页99
IC封装资料_电容_CL21B334KBFNFNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-12867.46 MB84页62
IC封装资料_电容_GRM1885C1H102FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121930944.07 KB30页102
IC封装资料_电容_CL21B334KBFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B334KBFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1213281.45 MB36页152
IC封装资料_电容_GRM1885C1H102GA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12807944.07 KB30页129
IC封装资料_电容_CL21B391KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213671.45 MB36页1
IC封装资料_电容_CC0402CRNPO9BN4R7.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12117417.81 MB176页270
IC封装资料_电源管理芯片_MCP1700T-3302E_TT.pdf
2005-2018MicrochipTechnologyInc.DS20001826E-page1MCP1700Features•AEC-Q100QualifiedandPPAPCapable•1.6µATypicalQuiescentCurrent...
2024-12-1218881.33 MB30页230
IC封装资料_电源管理芯片_MCP120T-315I_TT.pdf
2001MicrochipTechnologyInc.DS11184D-page1MCP120/130FEATURES•Holdsmicrocontrollerinresetuntilsupplyvoltagereachesstableoperating...
2024-12-12748316.43 KB16页3
IC封装资料_电容_GRM155R71E222KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12116920.26 KB29页217
IC封装资料_电容_GRM1885C1H102JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121958944.07 KB30页268
IC封装资料_电容_CL21B471KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210831.45 MB36页58
IC封装资料_电容_CL10B124KO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B124KO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1217141.45 MB36页80
IC封装资料_电容_CL21B472KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B472KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1211501.45 MB36页160
IC封装资料_电容_0805CG510J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216391.05 MB27页28
IC封装资料_电容_CL21B471KCANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121491.45 MB36页189
IC封装资料_电容_CC0402CRNPO9BN5R1.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1216611.22 MB13页177

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