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IC资料

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IC封装资料_电容_CL21B474KBFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B474KBFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-123531.45 MB36页264
IC封装资料_电容_CC0402CRNPO9BNR80.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121205998.46 KB11页290
IC封装资料_电容_GRM1885C1H120GA01D.pdf
GRM1885C1H120GA01_(0603,C0G:EIA,12pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121999944.07 KB30页63
IC封装资料_电容_CL10B152KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12483259.58 KB3页100
IC封装资料_电容_GRM1885C1H120FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121869944.07 KB30页111
IC封装资料_电容_CL21B475KAFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-126761.42 MB36页185
IC封装资料_电容_CL10B152KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12619259.58 KB3页203
IC封装资料_电容_0805CG681J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210781.05 MB27页227
IC封装资料_电容_CL21B474KOFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-123751.46 MB36页167
IC封装资料_电容_CC0402DRNPO9BN5R0.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-124921.22 MB13页185
IC封装资料_电感_YNR5020-101M.pdf
SMDPowerInductors-YNR5020Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12544664.7 KB5页209
IC封装资料_电容_CC0402DRNPO9BN6R0.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12106998.46 KB11页61
IC封装资料_电容_GRM1885C1H120JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12940944.07 KB30页128
IC封装资料_电感_YNR5020-100M.pdf
SMDPowerInductors-YNR5020Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121062664.7 KB5页117
IC封装资料_电源管理芯片_MCP73831T-2ACI_OT.pdf
2005-2014MicrochipTechnologyInc.DS20001984G-page1MCP73831/2Features:•LinearChargeManagementController:-IntegratedPassTransistor...
2024-12-12145915.63 KB28页62
IC封装资料_电容_CL21B475KOFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B475KOFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1215181.49 MB36页94
IC封装资料_电容_CC0402FRNPO9BN101.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121236998.46 KB11页236
IC封装资料_电容_GRM1885C1H121GA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121950944.07 KB30页22
IC封装资料_电容_CL10B152KC8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B152KC8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121614405.22 KB3页40
IC封装资料_电容_0805CG750J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129261.05 MB27页205

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