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IC资料

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IC封装资料_连接器_1830729.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12148136.13 MB445页192
IC封装资料_电感_YNR5040-1R0M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12399666.66 KB5页97
IC封装资料_电感_YNR5020-680M.pdf
SMDPowerInductors-YNR5020Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121277664.7 KB5页116
IC封装资料_连接器_1759062.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-128136.13 MB445页30
IC封装资料_电容_GRM1885C1H150GA01D.pdf
GRM1885C1H150GA01_(0603,C0G:EIA,15pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121292944.09 KB30页189
IC封装资料_电容_CC0402GRNPO9BN330.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1215431.22 MB13页43
IC封装资料_电容_GRM1885C1H150JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121254944.07 KB30页166
IC封装资料_电容_CL21C0R5BBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219661.45 MB36页244
IC封装资料_电容_CC0402JRNPO0BN100.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1215811.22 MB13页61
IC封装资料_电容_GRM1885C1H151GA01D.pdf
GRM1885C1H151GA01_(0603,C0G:EIA,150pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12346944.1 KB30页121
IC封装资料_电容_CL21C0R5CBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-121597.46 MB84页142
IC封装资料_电容_GRM1885C1H151JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12951944.07 KB30页226
IC封装资料_电容_GRM1885C1H160JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121211944.07 KB30页255
IC封装资料_电容_GRM1885C1H152JA01D.pdf
GRM1885C1H152JA01_(0603,C0G:EIA,1500pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12746944.1 KB30页235
IC封装资料_电容_CL21C1R5CBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-125207.46 MB84页69
IC封装资料_连接器_1830732.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12166136.13 MB445页99
IC封装资料_电容_GRM1885C1H162JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12530944.07 KB30页162
IC封装资料_电容_GRM1885C1H161JA01D.pdf
GRM1885C1H161JA01_(0603,C0G:EIA,160pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12383944.12 KB30页269
IC封装资料_电容_CL21C3R9CBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1210741.39 MB36页198
IC封装资料_电容_CL21C3R3CBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-121177.46 MB84页85

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