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IC资料

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IC封装资料_电容_CL21C102JBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-125321.45 MB36页13
IC封装资料_连接器_1844294.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/10-G-3,5OrderNo.:184429...
2024-12-121118246.9 KB5页160
IC封装资料_连接器_1844281.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/9-G-3,5OrderNo.:1844281...
2024-12-121255246.95 KB5页66
IC封装资料_连接器_1844278.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/8-G-3,5OrderNo.:1844278...
2024-12-121294246.95 KB5页47
IC封装资料_连接器_1844265.pdf
https://www.phoenixcontact.com/us/products/184426504/26/2016Page1/10Basestrip-MC1,5/7-G-3,5-1844265Pleasebeinformedthatthedatashow...
2024-12-12576354.84 KB11页131
IC封装资料_连接器_1844252.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/6-G-3,5OrderNo.:1844252...
2024-12-121192246.86 KB5页99
IC封装资料_电容_GRM1885C1H270FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12822944.07 KB30页298
IC封装资料_电容_GRM1885C1H242JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121793944.07 KB30页135
IC封装资料_电容_CL21C121JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12228316.31 KB3页96
IC封装资料_电容_CL21C120JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B472KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-122951.45 MB36页160
IC封装资料_电源管理芯片_MIC5247-1.8YM5-TR.pdf
MIC5247Micrel,Inc.February20061M9999-022406GeneralDescriptionTheMIC5247isanefficientandprecise,low-voltageCMOSvoltageregulatoropti...
2024-12-12737411.8 KB12页169
IC封装资料_电容_CL21C103JBFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-126461.39 MB36页103
IC封装资料_电源管理芯片_MIC5225-3.3YM5-TR.pdf
MIC5225Ultra-LowQuiescentCurrent150mAµCapLowDropoutRegulatorIttyBittyisaregisteredtrademarkofMicrel,Inc.MicrelInc.•2180FortuneDr...
2024-12-12969303.18 KB9页101
IC封装资料_连接器_1844317.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/12-G-3,5OrderNo.:184431...
2024-12-12937247.03 KB5页64
IC封装资料_连接器_1844304.pdf
https://www.phoenixcontact.com/us/produkte/184430410.10.2012Page1/6Basestrip-MC1,5/11-G-3,5-1844304Pleasebeinformedthatthedatashow...
2024-12-12154188.72 KB6页78
IC封装资料_电容_GRM155R71H153KA12D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121187920.26 KB29页69
IC封装资料_电容_CL21C151JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-122161.45 MB36页22
IC封装资料_电容_CL10B201KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B201KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121614361.44 KB3页286
IC封装资料_电容_CL10B183KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B183KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12561361.12 KB3页299
IC封装资料_电容_CL21C150JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-128101.45 MB36页41

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