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IC资料

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IC封装资料_电容_0805F225Z160CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1219991.26 MB20页167
IC封装资料_连接器_1881529.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC0,5/10-G-2,5OrderNo.:188152...
2024-12-12199251.3 KB5页134
IC封装资料_电感_YNR6045-4R7M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121603672.55 KB6页291
IC封装资料_电容_GRM1885C1H300GA01D.pdf
GRM1885C1H300GA01_(0603,C0G:EIA,30pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121631944.06 KB30页158
IC封装资料_电容_GRM1885C1H272JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12258944.07 KB30页10
IC封装资料_电源管理芯片_MIC5504-1.2YM5-TR.pdf
2019MicrochipTechnologyInc.DS20006006B-page1MIC5501/2/3/4Features•InputVoltageRange:2.5Vto5.5V•FixedOutputVoltagesfrom1.0Vto3....
2024-12-1213731.39 MB22页138
IC封装资料_电容_CL21C222JBFNNNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-122247.46 MB84页199
IC封装资料_电容_GRM155R71H221KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121662920.26 KB29页96
IC封装资料_连接器_1881558.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/4http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMCV0,5/2-G-2,5OrderNo.:188155...
2024-12-121544220.89 KB4页251
IC封装资料_电容_CL10B221KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121767259.58 KB3页29
IC封装资料_电容_0805F225Z250CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126571.26 MB20页250
IC封装资料_连接器_1881574.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/4http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMCV0,5/4-G-2,5OrderNo.:188157...
2024-12-12554221.07 KB4页16
IC封装资料_连接器_1881561.pdf
PHOENIXCONTACTInc.,USAPage1/4http://www.phoenixcon.comMar19,2008ExtractfromtheonlinecatalogMCV0,5/3-G-2,5OrderNo.:1881561Thefigure...
2024-12-12987223.15 KB4页28
IC封装资料_电容_GRM1885C1H300JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12891944.07 KB30页114
IC封装资料_电感_YNR6045-6R8M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121676672.55 KB6页96
IC封装资料_电容_CL21C270JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210791.45 MB36页73
IC封装资料_电源管理芯片_MIC29302WU-TR.pdf
2016-2019MicrochipTechnologyInc.DS20005685B-page1MIC2915X/30X/50X/75XFeatures•HighCurrentCapability:-MIC29150/29151/29152/29153...
2024-12-129252.63 MB42页108
IC封装资料_连接器_1881600.pdf
https://www.phoenixcontact.com/us/produkte/188160003.10.2012Page1/5Basestrip-MCV0.5/7-G-2.5-1881600Pleasebeinformedthatthedatashow...
2024-12-12838171.7 KB5页266
IC封装资料_电容_CL10B221KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B221KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12284361.45 KB3页200
IC封装资料_连接器_1881590.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/4http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMCV0,5/6-G-2,5OrderNo.:188159...
2024-12-121289221.12 KB4页60

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