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IC资料

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IC封装资料_连接器_1935271.pdf
https://www.phoenixcontact.com/us/products/193527108/04/2015Page1/6PCBterminalblock-PT1,5/13-5,0-H-1935271Pleasebeinformedthatthed...
2024-12-12783172.23 KB6页79
IC封装资料_连接器_1935268.pdf
https://www.phoenixcontact.com/us/products/193526808/04/2015Page1/6PCBterminalblock-PT1,5/12-5,0-H-1935268Pleasebeinformedthatthed...
2024-12-121422172.19 KB6页32
IC封装资料_连接器_1935255.pdf
https://www.phoenixcontact.com/us/products/193525508/04/2015Page1/6PCBterminalblock-PT1,5/11-5,0-H-1935255Pleasebeinformedthatthed...
2024-12-121261172.22 KB6页168
IC封装资料_电容_GRM1885C1H390GA01D.pdf
GRM1885C1H390GA01_(0603,C0G:EIA,39pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121281944.09 KB30页156
IC封装资料_电容_CL21C820JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210071.45 MB36页230
IC封装资料_电容_CL21C750JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-124051.45 MB36页169
IC封装资料_连接器_1935307.pdf
https://www.phoenixcontact.com/us/products/193530708/04/2015Page1/6PCBterminalblock-PT1,5/16-5,0-H-1935307Pleasebeinformedthatthed...
2024-12-121690172.21 KB6页256
IC封装资料_连接器_1935297.pdf
https://www.phoenixcontact.com/us/products/193529708/04/2015Page1/6PCBterminalblock-PT1,5/15-5,0-H-1935297Pleasebeinformedthatthed...
2024-12-121378172.23 KB6页265
IC封装资料_连接器_1935284.pdf
https://www.phoenixcontact.com/us/products/193528408/04/2015Page1/6PCBterminalblock-PT1,5/14-5,0-H-1935284Pleasebeinformedthatthed...
2024-12-12259172.18 KB6页62
IC封装资料_电容_GRM1885C1H390JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12680944.07 KB30页273
IC封装资料_电容_CL21F104ZBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-128791.45 MB36页256
IC封装资料_电源管理芯片_MP2143DJ-LF-Z.pdf
MP21433A,5.5V,1.2MHz,40μAIQ,COTSynchronousStepDownSwitcherMP2143Rev.1.07www.MonolithicPower.com17/4/2016MPSProprietaryInformation...
2024-12-12572564.87 KB14页48
IC封装资料_电容_GRM155R71H273KE14D.pdf
GRM155R71H273KE14_(0402,X7R:EIA,27000pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit...
2024-12-121961924.66 KB29页104
IC封装资料_连接器_5103308-5.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121657190.54 KB1页238
IC封装资料_连接器_5103308-3.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121060190.54 KB1页218
IC封装资料_电容_CL10B222KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B222KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121047361.48 KB3页131
IC封装资料_连接器_5103308-2.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121669190.54 KB1页187
IC封装资料_连接器_5103308-1.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12506190.54 KB1页219
IC封装资料_电容_CL10B222KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12972259.58 KB3页10
IC封装资料_电容_GRM1885C1H392JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12547944.07 KB30页22

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