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IC封装资料_电容_CL31C101JCCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121101.39 MB36页118
IC封装资料_电容_CL31B684KBHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31B684KBHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1215791.47 MB36页37
IC封装资料_电源管理芯片_NCP1271D65R2G.pdf
©SemiconductorComponentsIndustries,LLC,2009September,2009−Rev.61PublicationOrderNumber:NCP1271/DNCP1271Soft-Skip�ModeStandbyPWM...
2024-12-12133317.66 KB21页206
IC封装资料_连接器_A2541HWV-25P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121460815.29 KB16页36
IC封装资料_电容_CL10B224KB8VPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121900259.58 KB3页7
IC封装资料_电容_CL10B224KA8VPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12687259.58 KB3页202
IC封装资料_连接器_A2541HWV-24P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121039815.05 KB16页245
IC封装资料_连接器_A2541HWV-23P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121096814.78 KB16页97
IC封装资料_电容_0805N121J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-125371.26 MB20页141
IC封装资料_电容_GRM1885C1HR75BA01D.pdf
GRM1885C1HR75BA01_(0603,C0G:EIA,0.75pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12123944.13 KB30页163
IC封装资料_电容_GRM1885C1HR70BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12989944.07 KB30页58
IC封装资料_电感_YP0301-100M.pdf
SMDPowerInductors-YP0301Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121110719.3 KB5页210
IC封装资料_电容_CL31F225ZOCNNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-127307.46 MB84页182
IC封装资料_电源管理芯片_NCP5662DS33R4G.pdf
©SemiconductorComponentsIndustries,LLC,2013October,2019−Rev.161PublicationOrderNumber:NCP5662/DNCP5662,NCV5662LinearRegulator-Lo...
2024-12-121289734.24 KB15页270
IC封装资料_电容_CL10B224KO8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B224KO8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1217381.45 MB36页252
IC封装资料_电容_0805N152J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1217901.26 MB20页157
IC封装资料_电容_CL31F105ZBFNNNE.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL31F105ZBFNNNEProduct:Multi-layerCeramicCapacitor...
2024-12-1210031.39 MB36页128
IC封装资料_电容_0805N150J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1216501.26 MB20页219
IC封装资料_电感_YP0301-150M.pdf
SMDPowerInductors-YP0301Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12265719.3 KB5页87
IC封装资料_连接器_A2541HWV-27P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12578814.93 KB16页87

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