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IC资料

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IC封装资料_电感_YP0302-101M.pdf
SMDPowerInductors-YP0302Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12601775.67 KB5页141
IC封装资料_电容_GRM1885C2A161JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12283944.07 KB30页128
IC封装资料_电容_CS0402KRX7R8BB104.pdf
ProductSpecification–June19,2017V.4DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSSoftterminationNPOandX7R16VTO3KV0.47pFto2.2uF...
2024-12-1217792.46 MB19页276
IC封装资料_电源管理芯片_PAM2301CAABADJ.pdf
PAM2301Documentnumber:DS36384Rev.3-21of13www.diodes.comFebruary2018©DiodesIncorporatedPAM2301NEWPRODUCT800mASTEP-DOWNDC-DCCONVERT...
2024-12-125431.15 MB13页228
IC封装资料_电容_GRM188C71C475KE21D.pdf
GRM188C71C475KE21_(0603,X7S:EIA,4.7uF,DC16V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12200894.38 KB29页9
IC封装资料_连接器_AFC01-S13FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1210351.85 MB10页69
IC封装资料_电容_CL10B225KQ8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B225KQ8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-121451.45 MB36页239
IC封装资料_连接器_AFC01-S12H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-129041.58 MB1页9
IC封装资料_连接器_AFC01-S12FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-128741.85 MB10页223
IC封装资料_电容_0805N470J501CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215251.26 MB20页291
IC封装资料_电感_YP0302-150M.pdf
SMDPowerInductors-YP0302Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121222775.67 KB5页191
IC封装资料_电容_GRM1885C2A200JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121664944.07 KB30页165
IC封装资料_电源管理芯片_PAM2305AABADJ.pdf
PAM2305Documentnumber:DSxxxxxRev.2-61of17www.diodes.comJanuary2013©DiodesIncorporatedPAM2305AProductLineofDiodesIncorporated1ASTE...
2024-12-121582652.06 KB17页124
IC封装资料_电容_GRM1885C2A180JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12991944.07 KB30页22
IC封装资料_电容_DCK-3R3E224U-E.pdf
148NOTEDesign,Specificationsaresubjecttochangewithoutnotice.Askfactoryfortechnicalspecificationsbeforepurchaseand/oruse.CAT.No.200...
2024-12-12101136.13 KB1页9
IC封装资料_电容_GRM188C71E225KE11D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12441944.07 KB30页160
IC封装资料_电容_CS0805KKX7R8BB105.pdf
ProductSpecification–June19,2017V.4DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSSoftterminationNPOandX7R16VTO3KV0.47pFto2.2uF...
2024-12-126682.48 MB19页180
IC封装资料_电容_CL10B225KQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B225KQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210381.45 MB36页198
IC封装资料_电容_CC0402JRNPO9BN470.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1246917.81 MB176页172
IC封装资料_电容_0805N471J101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-127191.26 MB20页269

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