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IC资料

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IC封装资料_电容_CL10B332KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B332KB8WPNC●Product:Multi-layerCeramicCapacitorCAP,3.3㎋,50V,±10%,X7R,0603●AEC-Q200Quali...
2024-12-128095.82 MB36页107
IC封装资料_连接器_AFC01-S39H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-1214121.58 MB1页221
IC封装资料_电容_JDK063BJ105MP-FD.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121811653.27 KB26页21
IC封装资料_电容_CC0402KRX5R7BB224.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1210131.22 MB13页122
IC封装资料_连接器_AFC01-S40FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1213901.85 MB10页33
IC封装资料_电容_0805X475K160NT--2Kpcs.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216181.05 MB27页188
IC封装资料_电容_JDK105BJ106MV-FD.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12179653.27 KB26页198
IC封装资料_连接器_AFC01-S41FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-124171.85 MB10页144
IC封装资料_电感_YP0403-100M.pdf
SMDPowerInductors-YP0403Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121282776.45 KB5页276
IC封装资料_连接器_AFC01-S40H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-122301.58 MB1页149
IC封装资料_电感_YP0403-6R8M.pdf
SMDPowerInductors-YP0403Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12203776.45 KB5页21
IC封装资料_电容_JMK042BJ103KC-FW.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121922653.27 KB26页107
IC封装资料_电源管理芯片_REF3312AIDCKR.pdf
200180160140120100806040200Dropout�Voltage�(mV)�5�4�3�2�1012345Load�Current�(mA)+125C�+25C��40CR3R2VIN+2.7VEnable(1)...
2024-12-121401.86 MB39页190
IC封装资料_电容_JDK105BJ475MV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12280653.27 KB26页95
IC封装资料_电容_GRM188R60J474KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12757944.07 KB30页260
IC封装资料_电容_CC0402KRX5R7BB225.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219581.22 MB13页267
IC封装资料_连接器_AFC01-S41H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-122181.58 MB1页173
IC封装资料_电容_CL10B332KB85PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121851452.9 KB21页180
IC封装资料_电容_JMK063ABJ105MP-F.pdf
注意■本产品目录所记载的内容为2016年10月之内容。因改良等原因，可能会不经预告而变更记载内容，所以请务必在使用前先确认最新的产品信息...
2024-12-126441.83 MB52页72
IC封装资料_电容_0805X475K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125831.05 MB27页104

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