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IC资料

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IC封装资料_电感_YPRH1205-101M.pdf
SMDPowerInductors-YPRH1205Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-12979737.24 KB5页4
IC封装资料_连接器_KF2EDGCV-X-5.08-2P.pdf
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2024-12-121970627.15 KB1页216
IC封装资料_连接器_KF2EDGCVM-X-7.62-12P.pdf
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2024-12-12965634.58 KB1页9
IC封装资料_电源管理芯片_TLV1117LV33DCYR.pdf
INPUTOUTPUTGNDDeviceCIN1µFCOUT1µFProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityTLV1117LVSBVS160B–MAY2...
2024-12-1215011.04 MB25页290
IC封装资料_连接器_KF2EDGCV-X-5.08-6P.pdf
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2024-12-12738627.15 KB1页96
IC封装资料_电容_GRM188R71H221KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12906944.07 KB30页251
IC封装资料_连接器_KF2EDGCV-X-5.08-5P.pdf
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2024-12-12402627.15 KB1页234
IC封装资料_电容_CL10B684KQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B684KQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1212301.45 MB36页195
IC封装资料_连接器_KF2EDGCV-X-5.08-4P.pdf
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2024-12-121447627.15 KB1页124
IC封装资料_连接器_KF2EDGCV-X-5.08-3P.pdf
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2024-12-12639627.15 KB1页80
IC封装资料_电容_1206CG250J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121771.05 MB27页190
IC封装资料_电感_YPRH1205-102M.pdf
SMDPowerInductors-YPRH1205Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-121131737.24 KB5页44
IC封装资料_电容_T491C107K010AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-121681.54 MB23页295
IC封装资料_电源管理芯片_TLV62130ARGTR.pdf
40.050.060.070.080.090.0100.00.00.51.01.52.02.53.0VIN=5VVIN=12VVIN=17VOutputCurrent(A)Efficiency(%)VOUT=3.3Vfsw=1.25MHzG00122uFVOU...
2024-12-128302.09 MB40页77
IC封装资料_电容_GCJ31CL81E105KA01L.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1211404.72 MB73页266
IC封装资料_连接器_KF2EDGCV-X-5.08-9P.pdf
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2024-12-121351627.15 KB1页127
IC封装资料_电容_GRM188R71H222JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12141944.07 KB30页258
IC封装资料_电容_CL10B751KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B751KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121818361.15 KB3页291
IC封装资料_连接器_KF2EDGCV-X-5.08-8P.pdf
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2024-12-121620627.15 KB1页137
IC封装资料_连接器_KF2EDGCV-X-5.08-7P.pdf
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2024-12-121966627.15 KB1页174

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