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IC资料

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IC封装资料_电容_GRM188R71H223KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12122944.07 KB30页17
IC封装资料_连接器_KF2EDGRM-Y-3.5-5P.pdf
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2024-12-12616637.56 KB1页206
IC封装资料_电容_T491C476K016AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-122171.54 MB23页144
IC封装资料_电容_1206CG330J102NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-12811.05 MB27页186
IC封装资料_电容_GCJ31CR71H225KA12L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1210234.17 MB96页200
IC封装资料_电感_YPRH1205-331M.pdf
SMDPowerInductors-YPRH1205Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-121454737.24 KB5页59
IC封装资料_电源管理芯片_TLV70033DDCR.pdf
TLV700xxGNDENINOUTVINVOUTOnOffCINCOUT1FCeramic�ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityTLV700SLVS...
2024-12-121641.29 MB37页157
IC封装资料_连接器_KF2EDGRM-Y-3.5-9P.pdf
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2024-12-12893637.56 KB1页7
IC封装资料_电容_CL10B822KB85PNC.pdf
Supplier:Samsungelectro-mechanicsSamsungP/N:CL10B822KB85PNCProduct:Multi-layerCeramicCapacitorDescription:CAP,8.2㎋,50V,±...
2024-12-121626228.45 KB2页226
IC封装资料_连接器_KF2EDGRM-Y-3.5-8P.pdf
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2024-12-121182637.56 KB1页32
IC封装资料_连接器_KF2EDGRM-Y-3.5-7P.pdf
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2024-12-121842637.56 KB1页152
IC封装资料_电容_1206CG330J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217761.05 MB27页284
IC封装资料_电容_T491D106K035AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-127001.54 MB23页254
IC封装资料_电感_YPRH1205-470M.pdf
SMDPowerInductors-YPRH1205Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-121968737.24 KB5页122
IC封装资料_电容_GCJ31CR72A105KA01L.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1214885.94 MB73页89
IC封装资料_电源管理芯片_TLV70230DBVR.pdf
TLV702xxGNDENINOUTVINVOUTOnOffCINCOUT1FCeramic�ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTN...
2024-12-1219811.28 MB34页45
IC封装资料_电源管理芯片_TLV70218DBVR.pdf
TLV702xxGNDENINOUTVINVOUTOnOffCINCOUT1FCeramic�ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTN...
2024-12-1210771.28 MB34页19
IC封装资料_连接器_KF2EDGRM-Y-3.5-11P.pdf
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2024-12-12326637.56 KB1页292
IC封装资料_连接器_KF2EDGRM-Y-3.5-10P.pdf
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2024-12-121537637.56 KB1页152
IC封装资料_电容_GRM188R71H271KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12708944.07 KB30页11

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