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IC资料

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IC封装资料_连接器_1803468.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1236936.13 MB445页223
IC封装资料_电容_C212J103J4AC000.pdf
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2024-12-122522.2 MB6页223
IC封装资料_电容_AC0603KRX7R0BB472.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-125961.81 MB24页223
IC封装资料_电容_TAJE687K002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121676210.32 KB7页223
IC封装资料_电感_YSPI0740-100M.pdf
SMDPowerInductors-YSPI0740Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121204696.56 KB4页223
IC封装资料_连接器_KF2EDGCVM-X-7.62-5P.pdf
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2024-12-121923634.58 KB1页223
IC封装资料_电容_GCJ21BR71C225KA13L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1217054.17 MB96页223
IC封装资料_连接器_EDZ2502.pdf
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2024-12-121958391.75 KB1页223
IC封装资料_电感_YP1005-4R7M.pdf
SMDPowerInductors-YP1005Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12661776.32 KB5页223
IC封装资料_电容_CL10B471KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12410259.58 KB3页223
IC封装资料_电容_1206B223K631NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122711.05 MB27页223
IC封装资料_电容_EGW2GM5R6F16OC.pdf
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2024-12-1286815.39 MB230页223
IC封装资料_连接器_AFC01-S12FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-128731.85 MB10页223
IC封装资料_电容_GRM1885C2A100FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121491944.07 KB30页223
IC封装资料_电源管理芯片_MGJ2D152005SC.pdf
MGJ2Series5.2kVDCIsolated2WGateDriveDC-DCConvertersKDC_MGJ2_G01Page1of9www.murata-ps.comwww.murata-ps.com/supportForfulldetailsgot...
2024-12-12221321.61 KB9页223
IC封装资料_电容_CL21B104MBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-128251.45 MB36页223
IC封装资料_电容_GRM1885C1H3R0CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12151944.07 KB30页223
IC封装资料_电容_CL10B104KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121834259.58 KB3页223
IC封装资料_电容_CL21A106KAYNNNG.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-121277.55 MB84页223
IC封装资料_晶体管_ULN2003AN.pdf
7C6C5C4C3C2C1CCOM76543217B6B5B4B3B2B1B101112131415169ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMP...
2024-12-1215771.39 MB35页223

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