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IC资料

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IC封装资料_电容_GRM188R71H822JA01D.pdf
GRM188R71H822JA01_(0603,X7R:EIA,8200pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12197962.33 KB30页225
IC封装资料_连接器_FH12-7S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-12991339.76 KB6页225
IC封装资料_电容_GRM188R71E105MA12D.pdf
GRM188R71E105MA12_(0603,X7R:EIA,1uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121193895.3 KB29页225
IC封装资料_电容_MCRR25103X7RK0050.pdf
MCRRSeriesMultilayerCeramicCapacitorsPage131/05/05V1.0GeneralInformationLeadlength=25.4min,Leaddia=0.508C0G(NP0)DielectricSizeandC...
2024-12-12585252.83 KB5页225
IC封装资料_电容_GRM1885C2A221JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12344944.07 KB30页225
IC封装资料_电容_GRM1885C1H560JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121555944.07 KB30页225
IC封装资料_电容_CL21C510JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121920315.92 KB3页225
IC封装资料_电容_CL10B123KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B123KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12141361.45 KB3页225
IC封装资料_电容_CC0402CRNPO9BN3R6.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121427998.46 KB11页225
IC封装资料_锂电池专用芯片_LP4056HSPF.pdf
AEN(seeNoteA)BChargePumpVCCD−D+1D−1D+2D−2D+SOEDigitalControlProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&Commun...
2024-12-122402.65 MB30页225
IC封装资料_电感_SWPA4018S470MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-121501.32 MB22页225
IC封装资料_连接器_1731035.pdf
https://www.phoenixcontact.com/us/produkte/173103521.12.2012Page1/6PCBterminalblock-GMKDS3/3-1731035Pleasebeinformedthatthedatasho...
2024-12-121172175.69 KB6页225
IC封装资料_电感_NLV32T-151J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121073224.35 KB10页225
IC封装资料_电容_CC0603ZRY5V9BB104.pdf
SProductSpecification–March07,2017V.8DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralpurpose&HighcapacitanceClass2,Y5V6.3...
2024-12-1213131.08 MB13页225
IC封装资料_电感_NLV32T-012J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12124325.01 KB6页225
IC封装资料_电容_CC0603ZRY5V6BB105.pdf
SProductSpecification–March07,2017V.8DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralpurpose&HighcapacitanceClass2,Y5V6.3...
2024-12-1216121.08 MB13页225
IC封装资料_电容_0603B403K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124291.05 MB27页225
IC封装资料_电容_0402CG5R1C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121041.05 MB27页225
IC封装资料_电容_CC0805KKX7R9BB334.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211381.22 MB13页225
IC封装资料_电感_NLV25T-015J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV25-PF2520[1008inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV25-PFTypeNLV-PFSeries...
2024-12-12934215.06 KB9页225

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