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IC资料

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IC封装资料_电感_LQW18AN12NG00D.pdf
SpecNo.JELF243A-0024Y-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□00DREFERENCESPECIFICATION1.Scope...
2024-12-12824361.69 KB12页225
IC封装资料_电感_LQW15AN18NJ00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-12875376.63 KB15页225
IC封装资料_电容_UHD1C102MPD1TD.pdf
218ALUMINUMELECTROLYTICCAPACITORSCAT.8100HUHDHighRippleLowImpedanceLowerimpedanceathighfrequencyrange.Smallercasesizeandhighripple...
2024-12-12368767.78 KB3页225
IC封装资料_三极管_SI7288DP-T1-GE3.pdf
VishaySiliconixSi7288DPNewProductDocumentNumber:65366S09-2113-Rev.A,12-Oct-09www.vishay.com1DualN-Channel40-V(D-S)MOSFETFEATURES•...
2024-12-121838414.89 KB13页225
IC封装资料_三极管_IRFB3607PBF.pdf
01/20/12Benefits�ImprovedGate,AvalancheandDynamicdv/dtRuggedness�FullyCharacterizedCapacitanceandAvalancheSOA�Enhancedbodydiode...
2024-12-121023410.76 KB11页225
IC封装资料_三极管_DMN3404L-7.pdf
DMN3404LDocumentnumber:DS31787Rev.8-21of8www.diodes.comAugust2013©DiodesIncorporatedDMN3404LN-CHANNELENHANCEMENTMODEMOSFETProduct...
2024-12-121722427.91 KB8页225
IC封装资料_三极管_BS170.pdf
TolearnmoreaboutONSemiconductor,pleasevisitourwebsiteatwww.onsemi.comPleasenote:AspartoftheFairchildSemiconductorintegration,someo...
2024-12-1210601.47 MB17页225
IC封装资料_三极管_2N7002W-7-F.pdf
2N7002WDocumentnumber:DS30099Rev.14-21of4www.diodes.comSeptember2013©DiodesIncorporated2N7002WN-CHANNELENHANCEMENTMODEFIELDEFFECT...
2024-12-12378286.16 KB4页225
IC封装资料_电容_TMK325BJ226KM-P.pdf
注意■本产品目录所记载的内容为2016年10月之内容。因改良等原因，可能会不经预告而变更记载内容，所以请务必在使用前先确认最新的产品信息...
2024-12-1213351.83 MB52页225
IC封装资料_电容_TAJV157M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12505210.32 KB7页225
IC封装资料_电容_TAJV157K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121138210.32 KB7页225
IC封装资料_电容_CL10C100JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121971340.15 KB3页225
IC封装资料_电容_1808B102K202NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127231.05 MB27页225
IC封装资料_电容_CL10C020CB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121635339.99 KB3页225
IC封装资料_电容_TAJB685M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121662210.32 KB7页225
IC封装资料_电容_GCJ188R71H153KA01D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1214764.17 MB96页225
IC封装资料_电容_GRM188R71H822JA01D.pdf
GRM188R71H822JA01_(0603,X7R:EIA,8200pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12197962.33 KB30页225
IC封装资料_连接器_FH12-7S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-12991339.76 KB6页225
IC封装资料_电容_GRM188R71E105MA12D.pdf
GRM188R71E105MA12_(0603,X7R:EIA,1uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121193895.3 KB29页225
IC封装资料_电容_MCRR25103X7RK0050.pdf
MCRRSeriesMultilayerCeramicCapacitorsPage131/05/05V1.0GeneralInformationLeadlength=25.4min,Leaddia=0.508C0G(NP0)DielectricSizeandC...
2024-12-12583252.83 KB5页225

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