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IC资料

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IC封装资料_电容_GRM1885C2A221JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12344944.07 KB30页225
IC封装资料_电容_GRM1885C1H560JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121555944.07 KB30页225
IC封装资料_电容_CL21C510JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121920315.92 KB3页225
IC封装资料_电容_CL10B123KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B123KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12141361.45 KB3页225
IC封装资料_电容_CC0402CRNPO9BN3R6.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121427998.46 KB11页225
IC封装资料_锂电池专用芯片_LP4056HSPF.pdf
AEN(seeNoteA)BChargePumpVCCD−D+1D−1D+2D−2D+SOEDigitalControlProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&Commun...
2024-12-122402.65 MB30页225
IC封装资料_电感_SWPA4018S470MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-121501.32 MB22页225
IC封装资料_连接器_1731035.pdf
https://www.phoenixcontact.com/us/produkte/173103521.12.2012Page1/6PCBterminalblock-GMKDS3/3-1731035Pleasebeinformedthatthedatasho...
2024-12-121172175.69 KB6页225
IC封装资料_电感_NLV32T-151J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121073224.35 KB10页225
IC封装资料_电容_CC0603ZRY5V9BB104.pdf
SProductSpecification–March07,2017V.8DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralpurpose&HighcapacitanceClass2,Y5V6.3...
2024-12-1213131.08 MB13页225
IC封装资料_电感_NLV32T-012J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12124325.01 KB6页225
IC封装资料_电容_CC0603ZRY5V6BB105.pdf
SProductSpecification–March07,2017V.8DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralpurpose&HighcapacitanceClass2,Y5V6.3...
2024-12-1216121.08 MB13页225
IC封装资料_电容_0603B403K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124291.05 MB27页225
IC封装资料_电容_0402CG5R1C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121041.05 MB27页225
IC封装资料_电容_CC0805KKX7R9BB334.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211381.22 MB13页225
IC封装资料_电感_NLV25T-015J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV25-PF2520[1008inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV25-PFTypeNLV-PFSeries...
2024-12-12934215.06 KB9页225
IC封装资料_电容_CL21B105KPFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1215841.46 MB36页224
IC封装资料_电感_YNR3010-1R0M.pdf
SMDPowerInductors-YNR3010Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12786661.07 KB5页224
IC封装资料_电源管理芯片_LTC6652AHMS8-2.048_PBF.pdf
LTC665216652fgFormoreinformationwww.linear.com/LTC6652FeaturesapplicationsDescriptionPrecisionLowDriftLowNoiseBufferedReferenceThe...
2024-12-1294629.27 KB20页224
IC封装资料_晶体管_IRLML5203TR.pdf
ParameterMax.UnitsVDSDrain-SourceVoltage-30VID@TA=25°CContinuousDrainCurrent,VGS@-10V-3.0ID@TA=70°CContinuousDrainCurrent,VGS@-1...
2024-12-121004302.1 KB10页224

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