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IC资料

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IC封装资料_电容_CC0201JRNPO9BN680.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-121481.22 MB13页195
IC封装资料_电感_SWPA252010SR47NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-127191.32 MB22页195
IC封装资料_电容_GRM155R61A105KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12103920.26 KB29页195
IC封装资料_电源管理芯片_XL8003.pdf
XLSEMIDatasheet80V0.5ASwitchingCurrentBuckPFMLEDConstantCurrentDriverXL8003Rev1.2www.xlsemi.com1FeaturesnWide24Vto80VInputVoltageR...
2024-12-12891225.45 KB7页195
IC封装资料_电源管理芯片_LTC3407EDD-2_TRPBF.pdf
LTC3407-2134072fcL,LT,LTC,LTM,BurstMode,LinearTechnologyandtheLinearlogoareregisteredtrademarksofLinearTechnologyCorporation.Allot...
2024-12-121410341.53 KB16页195
IC封装资料_电容_CL10A224KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121681259.57 KB3页195
IC封装资料_电容_0805B104J101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1219161.26 MB20页195
IC封装资料_电感_SDFL1005Q2R7KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-12630457.75 KB7页195
IC封装资料_电容_CC1206KKX7RZBB222.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-124231.22 MB13页195
IC封装资料_电容_GRM1885C1H6R8CA01D.pdf
GRM1885C1H6R8CA01_(0603,C0G:EIA,6.8pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12415944.09 KB30页194
IC封装资料_电容_CL21B104KBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B104KBCNNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121580361.42 KB3页194
IC封装资料_电容_0805CG102K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1220001.05 MB27页194
IC封装资料_连接器_310S-26P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12191816.96 KB1页194
IC封装资料_电容_CL21A106KOQNNNG.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1213857.55 MB84页194
IC封装资料_电容_C823A104J90C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1217132.9 MB5页194
IC封装资料_电容_C0603C102J5RACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-1217421.48 MB25页194
IC封装资料_电感_SWPA3015S2R2NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-124681.32 MB22页194
IC封装资料_电感_SWPA3012S4R7MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-126691.32 MB22页194
IC封装资料_电容_0805B105K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121191.05 MB27页194
IC封装资料_电源管理芯片_LTC3676EUJ_PBF.pdf
LTC3676/LTC3676-11Rev.GFormoreinformationwww.analog.comTYPICALAPPLICATIONFEATURESDESCRIPTIONPowerManagementSolutionforApplicationP...
2024-12-12562.2 MB38页194

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