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IC资料

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IC封装资料_三极管_MJD112T4G.pdf
©SemiconductorComponentsIndustries,LLC,2013November,2013−Rev.131PublicationOrderNumber:MJD112/DMJD112(NPN),MJD117(PNP)Complement...
2024-12-12949232.22 KB10页219
IC封装资料_三极管_IRF4905PBF.pdf
IRF4905PbFHEXFET®PowerMOSFETPD-94816FifthGenerationHEXFETsfromInternationalRectifierutilizeadvancedprocessingtechniquestoachievee...
2024-12-121324270.31 KB9页219
IC封装资料_电容_TAJD685M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121342210.32 KB7页219
IC封装资料_电容_TAJD337M006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12853208.62 KB7页219
IC封装资料_电容_CL10C010BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12512259.58 KB3页219
IC封装资料_电感_YSPI0740-330M.pdf
SMDPowerInductors-YSPI0740Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-12908696.56 KB4页219
IC封装资料_电容_GRM219R61H105KA73D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12135810.43 MB296页219
IC封装资料_电容_GCJ188R91E334KA01D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-123985.94 MB73页219
IC封装资料_连接器_SM05B-GHS-TBT.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121796661.04 KB4页219
IC封装资料_连接器_KF635-6.35-2P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12442704.98 KB1页219
IC封装资料_连接器_KF170V-5.0-4P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121769207.6 KB1页219
IC封装资料_连接器_IPEX-20455-040E.pdf
NEWPRODUCTINFORMATIONNEWPRODUCTINFORMATION©2009I-PEXCo.,Ltd.200909rev.2http://www.i-pex.comHeadOffice6-27-19Haramachida,MachidaCi...
2024-12-121745459.1 KB2页219
IC封装资料_电容_CL10B682KB85PNC.pdf
Supplier:Samsungelectro-mechanicsSamsungP/N:CL10B682KB85PNCProduct:Multi-layerCeramicCapacitorDescription:CAP,6.8㎋,50V,±...
2024-12-121137228.47 KB2页219
IC封装资料_连接器_DF12E_4.0_-30DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12925288.67 KB11页219
IC封装资料_电容_1206B681K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216571.05 MB27页219
IC封装资料_电容_GRM188R70J105KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12197944.07 KB30页219
IC封装资料_电容_CC0402KRX7R7BB153.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1218331.22 MB13页219
IC封装资料_电容_0805X225K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-12561.05 MB27页219
IC封装资料_电容_0805N150J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1216501.26 MB20页219
IC封装资料_连接器_5103308-1.pdf
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2024-12-12506190.54 KB1页219

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