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IC资料

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IC封装资料_电容_T491A476M006AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1211991.54 MB23页206
IC封装资料_电源管理芯片_TLC5941PWPR.pdf
PWPRHBNT1FEATURESAPPLICATIONSDESCRIPTIONDelayx06−Bit�Dot�Correction12−Bit�GrayscalePWM�ControlDC�RegisterGS�RegisterConsta...
2024-12-124722.48 MB36页206
IC封装资料_电容_SPZ0JM471E09C30R.pdf
|A川川I~'jI~.~盯ROLYTICCAPACITORSAiSH~PartNumberingSystem日E回8:liJ囚lli囚~回113114国回①Category∞deCodeTypeEle恼。IyticCspacitor...
2024-12-126926.41 MB11页206
IC封装资料_电容_EMK105B7333KV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121647653.27 KB26页206
IC封装资料_电容_CL10B271KC8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B271KC8WPNC●Product:Multi-layerCeramicCapacitorCAP,270㎊,100V,±10%,X7R,0603●AEC-Q200Qual...
2024-12-124235.82 MB36页206
IC封装资料_连接器_A2541HWV-40P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12212815.07 KB16页206
IC封装资料_电源管理芯片_NCP1271D65R2G.pdf
©SemiconductorComponentsIndustries,LLC,2009September,2009−Rev.61PublicationOrderNumber:NCP1271/DNCP1271Soft-Skip�ModeStandbyPWM...
2024-12-12133317.66 KB21页206
IC封装资料_电源管理芯片_MP8759.pdf
MP875926V,8A,LowIQ,High-Current,Synchronous,Step-DownConverterMP8759Rev.1.1www.MonolithicPower.com14/13/2017MPSProprietaryInformat...
2024-12-121241800.98 KB22页206
IC封装资料_电容_GRM1885C1H221GA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-1258944.07 KB30页206
IC封装资料_电容_GRM1555C1H6R2BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12458920.26 KB29页205
IC封装资料_三极管_NTJD4001NT1G.pdf
©SemiconductorComponentsIndustries,LLC,2015May,2019−Rev.71PublicationOrderNumber:NTJD4001N/DNTJD4001N,NVTJD4001NMOSFET–Dual,N-C...
2024-12-12728204.66 KB5页205
IC封装资料_三极管_IRF520NPBF.pdf
IRF520NPbFHEXFET®PowerMOSFETPD-94818FifthGenerationHEXFETsfromInternationalRectifierutilizeadvancedprocessingtechniquestoachievee...
2024-12-121177261.94 KB9页205
IC封装资料_电容_TAJV476K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12624210.31 KB7页205
IC封装资料_电容_TAJD157M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121996210.32 KB7页205
IC封装资料_电容_GCM21BR71C105KA58L.pdf
GCM21BR71C105KA58_(0805,X7R:EIA,1uF,DC16V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121203948.27 KB29页205
IC封装资料_电容_CL10C8R2CB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121308316.2 KB3页205
IC封装资料_嵌入式微处理器_HC32L136J8TA-LQ48.pdf
HC32L130系列/HC32L136系列32位ARM®Cortex®-M0+微控制器数据手册产品特性⚫48MHzCortex-M0+32位CPU平台⚫HC32L130/HC32L136系列具有灵活...
2024-12-127551.85 MB77页205
IC封装资料_电容_CL10C4R3CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12744259.57 KB3页205
IC封装资料_连接器_SM06B-GHS-TB.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121837661.03 KB4页205
IC封装资料_电容_1206CG180J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127531.05 MB27页205

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