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IC资料

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IC封装资料_电容_C1005C0G1H330F050BA.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-129581.65 MB57页291
IC封装资料_电容_C1608Y5V1H104Z.pdf
Issuedate:April2011TDKMLCCUSCatalogVersionB11CSeriesGeneralApplicationType:C0402[EIACC01005]C0603[EIACC0201]C1005[EIACC0402]C1608[...
2024-12-129941.42 MB72页291
IC封装资料_电源管理芯片_LTC6803HG-2_TRPBF.pdf
LTC6803-2/LTC6803-41680324faTYPICALAPPLICATIONFEATURESDESCRIPTIONMulticellBatteryStackMonitorTheLTC®6803isa2ndgeneration,complete...
2024-12-12766486.53 KB40页291
IC封装资料_电容_GRM155R71C472KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121189920.26 KB29页291
IC封装资料_电源管理芯片_MCP1702T-5002E_MB.pdf
2010MicrochipTechnologyInc.DS22008E-page1MCP1702Features:•2.0µAQuiescentCurrent(typical)•InputOperatingVoltageRange:2.7Vto13....
2024-12-12321519.12 KB26页291
IC封装资料_电容_CC0402CRNPO9BN5R6.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-123161.22 MB13页291
IC封装资料_电容_GRM1885C1H122FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12709944.07 KB30页291
IC封装资料_电感_YNR5020-330M.pdf
SMDPowerInductors-YNR5020Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12709664.7 KB5页291
IC封装资料_电容_GRM155R71H123KA12D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12486920.26 KB29页291
IC封装资料_电感_YNR6045-4R7M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121603672.55 KB6页291
IC封装资料_电容_CL31A476MPHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31A476MPHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-123381.48 MB36页291
IC封装资料_电容_0805N470J501CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215241.26 MB20页291
IC封装资料_连接器_BM28B0.6-24DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12641562.52 KB8页291
IC封装资料_电容_1206B391K102NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121961.05 MB27页291
IC封装资料_连接器_DF12_3.0_-80DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12496288.67 KB11页291
IC封装资料_连接器_DF12B_3.0_-50DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12268288.67 KB11页291
IC封装资料_连接器_DF12C-30DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121551288.67 KB11页291
IC封装资料_电容_1206CG101J101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217231.05 MB27页291
IC封装资料_电容_CL10B751KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B751KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121818361.15 KB3页291
IC封装资料_电容_1206F104M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210331.05 MB27页291

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