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IC资料

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IC封装资料_连接器_KF2EDGR-X-5.0-11P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12148620.67 KB1页292
IC封装资料_电源管理芯片_TM1621.pdf
LCD驱动器TM16211©TitanMicroElectronicswww.titanmec.comV1.4概述TM1621是内存映象和多功能的LCD驱动器，TM1621的软件配置特性使它适用于...
2024-12-123021.6 MB17页292
IC封装资料_电感_YSPI0730-R47M.pdf
SMDPowerInductors-YSPI0730Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-12766702.26 KB5页292
IC封装资料_电容_CL10C9R1CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12335259.58 KB3页292
IC封装资料_电容_TAJC476K006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121001210.32 KB7页292
IC封装资料_电容_TAJV106M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121321210.32 KB7页292
IC封装资料_电源管理芯片_XC6210B332MR-G.pdf
1/27XC6210SeriesHighCurrent,HighSpeedLDORegulators■FEATURESMaximumOutputCurrent:Morethan700mA(800mAlimit,TYP.)(1.60V
2024-12-12966551.71 KB27页292
IC封装资料_电容_CL10C221JB8NNWC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-129511.42 MB36页292
IC封装资料_电源管理芯片_XC9236A33CMR-G.pdf
1/40XC9235/XC9236/XC9237Series600mADriverTr.Built-In,SynchronousStep-DownDC/DCConverters01020304050607080901000.11101001000OutputC...
2024-12-128281.11 MB40页292
IC封装资料_数据转换器_AD5628ARUZ-2.pdf
Octal,12-/14-/16-Bit,SPIVoltageOutputdenseDACwith5ppm/°C,On-ChipReferenceDataSheetAD5628/AD5648/AD5668Rev.JDocumentFeedbackInform...
2024-12-1214551.04 MB30页292
IC封装资料_微控制器_TMP86FH09ANGG,ZHZ.pdf
8BitMicrocontrollerTLCS-870/CSeriesTMP86FH09ANG更多资料下载请到五八文库wk.58sms.comRevisionHistoryDateRevision2007/4/91FirstReleas...
2024-12-125661.89 MB200页292
IC封装资料_变压器_TCM1-83X+.pdf
Page1of2NotesA.Performanceandqualityattributesandconditionsnotexpresslystatedinthisspecificationdocumentareintendedtobeexcludedand...
2024-12-12446516.14 KB3页291
IC封装资料_电容_0201CG8R2C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216211.05 MB27页291
IC封装资料_电容_0201HQ1R2B250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216301.05 MB27页291
IC封装资料_电容_GCM188R71H222KA37D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-121574.17 MB96页291
IC封装资料_电感_LQW18AN56NG00D.pdf
SpecNo.JELF243A-0024Y-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□00DREFERENCESPECIFICATION1.Scope...
2024-12-121092333.23 KB11页291
IC封装资料_电感_LQW18ANR39J00D.pdf
SpecNo.JELF243A-0024Y-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□00DREFERENCESPECIFICATION1.Scope...
2024-12-121074333.23 KB11页291
IC封装资料_电容_0402B105K100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214561.05 MB27页291
IC封装资料_电容_GCM1555C1H6R8BA16D.pdf
GCM1555C1H6R8BA16_(0402,C0G:EIA,6.8pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121549943.98 KB29页291
IC封装资料_电感_NLCV32T-R47M-EFR.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121457249.79 KB16页291

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