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IC资料

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IC封装资料_电容_CL10B223KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12398452.9 KB21页179
IC封装资料_电源管理芯片_MP2359DJ-LF-Z.pdf
MP23591.2A,24V,1.4MHzStep-DownConverterinaTSOT23-6MP2359Rev.1.21www.MonolithicPower.com17/18/2011MPSProprietaryInformation.PatentP...
2024-12-12359497.61 KB11页179
IC封装资料_电容_GRM1885C1H222JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121014944.07 KB30页179
IC封装资料_电容_0805CG561J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129631.05 MB27页179
IC封装资料_电容_CL21A225KOFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A225KOFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-12395360.64 KB3页179
IC封装资料_电容_CL10F104ZA8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F104ZA8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-12444360.47 KB3页179
IC封装资料_连接器_1758144.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12128536.13 MB445页179
IC封装资料_电感_SWPA6045S100MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-128721.32 MB22页179
IC封装资料_电容_CC1206KRX7RYBB332.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12837998.46 KB11页179
IC封装资料_电容_CC1206JKNPOCBN220.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211151.22 MB13页179
IC封装资料_电源管理芯片_LT1963AEFE_PBF.pdf
LT1963ASeries11963affFormoreinformationwww.linear.com/LT1963ATypicalapplicaTionDescripTion1.5A,LowNoise,FastTransientResponseLDORe...
2024-12-12662629.18 KB28页179
IC封装资料_电容_0402CG9R1C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-12611.05 MB27页179
IC封装资料_电容_0402B223K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212841.05 MB27页179
IC封装资料_电感_LQW15AN6N8J00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-121157376.63 KB15页179
IC封装资料_电感_LQP15MN4N7B02D.pdf
SpecNo.JELF243C-0007P-01P.1/9MURATAMFG.CO.,LTD.ReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP15MN□□□□02DReferenceSpecification1.Scope...
2024-12-12608245 KB9页179
IC封装资料_电容_CC0603GRNPO9BN200.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121282998.46 KB11页179
IC封装资料_电源管理芯片_AD737JRZ-RL.pdf
LowCost,LowPower,TrueRMS-to-DCConverterDataSheetAD737Rev.JDocumentFeedbackInformationfurnishedbyAnalogDevicesisbelievedtobeaccurat...
2024-12-12514614.74 KB24页179
IC封装资料_连接器_1755558.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogMSTBVA2,5/6-GOrderNo.:1755558...
2024-12-121205230.03 KB5页178
IC封装资料_电感_MLF2012DR33JT000.pdf
February2017INDUCTORSFebruary2017积层铁氧体MLF20122012[0805inch]**表示尺寸代码。JIS[EIA]普通电路用电感器MLF2012型MLF系列更多资料下...
2024-12-121809441.86 KB11页178
IC封装资料_电容_CC0603JRNPO9BN681.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12108117.81 MB176页178

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