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IC资料

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IC封装资料_电容_GRM1885C1H9R1CA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comForapplicationsthatdonotrequir...
2024-12-1211514.37 MB90页183
IC封装资料_电容_GRM155R71C393KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12421920.26 KB29页183
IC封装资料_电容_GRM1555C1H621JA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12145010.43 MB296页183
IC封装资料_电容_CL10B102KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12403259.58 KB3页183
IC封装资料_电感_SWPA6045S560MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211021.32 MB22页183
IC封装资料_电感_SWPA3015S470MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-129191.32 MB22页183
IC封装资料_电感_SLF6028T-101MR42-PF.pdf
INDUCTORSApril2016WoundFerriteSLF6028InductorsforPowerCircuitsSLF6028TypeSLFSeries更多资料下载请到五八文库wk.58sms.com(2/9)INDUCTO...
2024-12-12362229.58 KB9页183
IC封装资料_电感_SDFL2012Q1R0KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121535457.75 KB7页183
IC封装资料_电感_SDFL2012LR15KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121395457.75 KB7页183
IC封装资料_电源管理芯片_LTC3412AEFE_PBF.pdf
LTC3412A13412affFormoreinformationwww.linear.com/LTC3412AFormoreinformationwww.linear.com/LTC3412AAPPLICATIONSnPoint-of-LoadRegula...
2024-12-121774533.81 KB20页183
IC封装资料_电源管理芯片_LT3505IMS8E_TRPBF.pdf
LT350513505fcTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION1.2A,Step-DownSwitchingRegulatorin3mm×3mmDFNTheLT®3505isacurrentmo...
2024-12-121203896.8 KB24页183
IC封装资料_电源管理芯片_LM2576-5.0WU.pdf
August20051M9999-082605-BLM2576Micrel,Inc.LM257652kHzSimple3ABuckRegulatorGeneralDescriptionTheLM2576seriesofmonolithicintegratedc...
2024-12-121608146.58 KB9页183
IC封装资料_电源管理芯片_LM1117DTX-3.3_NOPB.pdf
ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityReferenceDesignLM1117SNOS412N–FEBRUARY2000–REVISEDJANUAR...
2024-12-1213462.88 MB40页183
IC封装资料_电感_NLV25T-047J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12615318.58 KB6页183
IC封装资料_电容_CL21B224KAFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-123881.46 MB36页182
IC封装资料_电容_CL21B102KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215821.45 MB36页182
IC封装资料_电容_0805CG121J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215531.05 MB27页182
IC封装资料_电容_GRM1555C1H910JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12669920.26 KB29页182
IC封装资料_电容_0805B331K101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1219891.26 MB20页182
IC封装资料_电源管理芯片_LTC3855EUJ_TRPBF.pdf
LTC38553855fTypicalapplicaTionDescripTionDual,MultiphaseSynchronousDC/DCControllerwithDifferentialRemoteSenseTheLTC®3855isadualPo...
2024-12-1219122.16 MB44页182

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