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IC资料

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IC封装资料_电容_GRM1555C1H4R2CA01D.pdf
GRM1555C1H4R2CA01_(0402,C0G:EIA,4.2pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121381944.33 KB30页182
IC封装资料_三极管_DMN63D8L-7.pdf
DMN63D8LDocumentnumber:DS38026Rev.1-21of6www.diodes.comAugust2015©DiodesIncorporatedDMN63D8LNEWPRODUCTNEWPRODUCTN-CHANNELENHANCEM...
2024-12-12804634.58 KB6页182
IC封装资料_电容_TAJC106K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12619210.32 KB7页182
IC封装资料_电容_TAJB685M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12115210.32 KB7页182
IC封装资料_电容_TAJA335M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12927210.32 KB7页182
IC封装资料_连接器_KF103-5.0-8P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121953205.01 KB1页182
IC封装资料_电容_GRM188R71H332KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12840944.07 KB30页182
IC封装资料_电容_CL10B562KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12955259.58 KB3页182
IC封装资料_电容_CL10B393KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121611259.58 KB3页182
IC封装资料_电容_EMK105BJ105KV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121705857.12 KB55页182
IC封装资料_电感_YP0503-2R2M.pdf
SMDPowerInductors-YP0503Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12376776.48 KB5页182
IC封装资料_电感_YP0402-470M.pdf
SMDPowerInductors-YP0402Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12191771.92 KB4页182
IC封装资料_电容_CC0402JRNPO9BN510.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126471.22 MB13页182
IC封装资料_电容_GRM1885C2A101FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12357944.07 KB30页182
IC封装资料_电容_CL31F225ZOCNNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-127307.46 MB84页182
IC封装资料_电容_0805F824M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214431.05 MB27页182
IC封装资料_三极管_UMW_8205A.pdf
DualN-ChannelEnhancementModeMOSFETSYMBOLABSOLUTEMAXIMUMRATINGSParameterSymbolRatingUnitDrain-SourceVoltageVDSS20VGate-SourceVoltag...
2024-12-121104784.53 KB4页181
IC封装资料_三极管_DMC3021LSD-13.pdf
DMC3021LSDDocumentnumber:DS32152Rev.3-21of9www.diodes.comNovember2018©DiodesIncorporatedDMC3021LSDD2S2G2D1S1G1COMPLEMENTARYPAIREN...
2024-12-12261530.36 KB9页181
IC封装资料_电源管理芯片_UC3844BNG.pdf
©SemiconductorComponentsIndustries,LLC,2013August,2013−Rev.111PublicationOrderNumber:UC3844B/DUC3844B,UC3845B,UC2844B,UC2845BHig...
2024-12-12887482.14 KB19页181
IC封装资料_三极管_BSS84W-7-F.pdf
BSS84WDocumentnumber:DS30205Rev.17–21of5www.diodes.comJune2019©DiodesIncorporatedBSS84WP-CHANNELENHANCEMENTMODEFIELDEFFECTTRANSI...
2024-12-121937507.34 KB5页181

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