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IC资料

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IC封装资料_电容_CL21B105KOFNFNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KOFNFNE·Product:Multi-layerCeramicCapacitor...
2024-12-12159456.17 KB3页118
IC封装资料_电源管理芯片_LTC6652BHMS8-1.25_PBF.pdf
LTC665216652fgFormoreinformationwww.linear.com/LTC6652FeaturesapplicationsDescriptionPrecisionLowDriftLowNoiseBufferedReferenceThe...
2024-12-12170629.27 KB20页118
IC封装资料_电容_CL10C471JB8NNWC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-122551.42 MB36页118
IC封装资料_电源管理芯片_LTC4065EDC_TRPBF.pdf
1LTC4065/LTC4065A4065fb■WirelessPDAs■CellularPhones■PortableElectronicsStandalone750mALi-IonBatteryChargerin2×2DFN■CompleteLi...
2024-12-121427292.13 KB16页118
IC封装资料_电源管理芯片_LTC1966CMS8_PBF.pdf
LTC196611966fbTypicalapplicaTionFeaTuresDescripTionPrecisionMicropower∆∑RMS-to-DCConverterapplicaTionsL,LT,LTC,LTM,LinearTechnol...
2024-12-1278475.1 KB38页118
IC封装资料_电容_CC1210ZKY5V6BB226.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-12611.22 MB13页118
IC封装资料_电容_0603CG821J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126431.05 MB27页118
IC封装资料_电容_GRM033C71C104KE14D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12143610.43 MB296页118
IC封装资料_电感_NLV32T-680J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121645224.35 KB10页118
IC封装资料_电感_NLCV32T-4R7M-EFD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121449249.79 KB16页118
IC封装资料_电容_GCM1885C1H821JA16D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1218394.17 MB96页118
IC封装资料_电容_CC1206JRX7R9BB103.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121385998.46 KB11页118
IC封装资料_电源管理芯片_LT3060IDC-5_TRPBF.pdf
LT3060Series13060fcFormoreinformationwww.linear.com/LT3060TypicalapplicaTionDescripTion45VVIN,Micropower,LowNoise,100mALowDropout,...
2024-12-12583515.79 KB26页118
IC封装资料_电感_NLCV25T-1R5M-EF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121818249.79 KB16页118
IC封装资料_电容_CC0603KRX7R9BB121.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211811.22 MB13页118
IC封装资料_电容_0402B562K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122201.05 MB27页118
IC封装资料_连接器_1754494.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/6http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogMSTB2,5/5-GOrderNo.:1754494Th...
2024-12-121290401.8 KB6页118
IC封装资料_电源管理芯片_HX7333.pdf
HX73XX系列Ver2.00(1/7)系列LDO线性稳压器■产品简介系列是一款实用CMOS技术开发的低压差、高精度输出电压、超低功耗电流的正电压型电压稳...
2024-12-12437510.83 KB7页118
IC封装资料_连接器_1727052.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12121436.13 MB445页118
IC封装资料_电感_LQG15HS5N1S02D.pdf
SpecNo.:JELF243B_0010T-01P1/13MURATAMFGCO.,LTDCHIPCOILS(CHIPINDUCTORS)LQG15HS□□□□02□REFERENCESPECIFICATION1.ScopeThisreferenc...
2024-12-121834454.09 KB13页118

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