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IC资料

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IC封装资料_电容_CL10B391KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B391KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1287361.34 KB3页107
IC封装资料_电容_JMK316BJ476ML-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12241653.27 KB26页107
IC封装资料_电容_JMK042BJ103KC-FW.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121923653.27 KB26页107
IC封装资料_电容_CL10B332KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B332KB8WPNC●Product:Multi-layerCeramicCapacitorCAP,3.3㎋,50V,±10%,X7R,0603●AEC-Q200Quali...
2024-12-128105.82 MB36页107
IC封装资料_电容_CC0402JRNPO9BN471.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-123111.22 MB13页107
IC封装资料_电容_CL10B223KB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12835259.58 KB3页107
IC封装资料_电容_GRM155R71H152KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1251920.26 KB29页107
IC封装资料_信号隔离芯片_FOD2712V_Q.pdf
4/10/03OPTICALLYISOLATEDERRORAMPLIFIERPage1of13FOD2712©2003FairchildSemiconductorCorporationPACKAGEDIMENSIONSFUNCTIONALBLOCKDIAGR...
2024-12-12125670.43 KB14页106
IC封装资料_电源管理芯片_XL2013.pdf
Datasheet5V/3.2A150KHz40VBuckDCtoDCConverterForUSBInterfaceXL2013Rev1.0www.xlsemi.com1Features�Wide8Vto40Vinputvoltagerange.�Fix...
2024-12-121822412.4 KB9页106
IC封装资料_三极管_SK2300A.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1215161.1 MB4页106
IC封装资料_三极管_BSS138DW-7-F.pdf
BSS138DWDocumentnumber:DS30203Rev.13-21of6www.diodes.comJanuary2014©DiodesIncorporatedBSS138DWDUALN-CHANNELENHANCEMENTMODEFIELDEF...
2024-12-121136296.85 KB6页106
IC封装资料_电容_UCD1E101MCL1GS.pdf
132UUUUA247jCD(φ4toφ8×6.2)(φ12.5toφ18)(φ8×10,φ10)0.3MAX.φD±0.5B±0.2A±0.2A±0.2C±0.20.5MAX.EHH0.3MAX.φD±0.5B±0.2A±...
2024-12-12893817.62 KB2页106
IC封装资料_电容_TAJV476M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121482210.32 KB7页106
IC封装资料_电容_12065C105JAT2A.pdf
SurfaceMountCeramicCapacitorProducts更多资料下载请到五八文库wk.58sms.comCeramicChipCapacitorsTableofContentsHowtoOrderPartNumberEx...
2024-12-1259614.69 MB133页106
IC封装资料_电源管理芯片_TPS51200DRCR.pdf
23451987610TPS51200REFINVLDOINVOPGNDVOSNSVINPGOODGNDENREFOUT3.3VINPGOODSLP_S3VTTREFVLDOINVTTVDDQCopyright©2016,TexasInstrumentsIn...
2024-12-1212802.11 MB39页106
IC封装资料_电源管理芯片_TPS3824-33DBVR.pdf
−401.00110.9990.998−151035TA−Free-AirTemperature−C°0.9970.9960.9956085NormalizedInputThresholdVoltage−VIT(TA),VIT(25C)°VDDV...
2024-12-1210561.14 MB29页106
IC封装资料_电容_TAJA476K006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12762210.32 KB7页106
IC封装资料_电容_GRM188R71H821KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121215944.07 KB30页106
IC封装资料_连接器_KF124-3.5-10P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121508203.82 KB1页106
IC封装资料_电容_GRM188R71H272KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12479944.07 KB30页106

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