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IC资料

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IC封装资料_电容_0201CG200K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219261.05 MB27页91
IC封装资料_电感_LQG15HS1N1S02D.pdf
SpecNo.JELF243B-0010S-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12590361.38 KB11页91
IC封装资料_电容_UVY1V221MPD.pdf
ALUMINUMELECTROLYTICCAPACITORS186CAT.8100HφDPφd52.00.56.32.50.583.50.6105.00.612.55.00.6167.50.8187.50.8202210.010.01.01.0U1V2Y3...
2024-12-12985682.18 KB2页91
IC封装资料_连接器_53398-1371.pdf
TABLE11番号NO.部品PART材質MATERIAL①ハウジングHOUSINGポリアミド(PA),UL94V-0,GLASS-FILLED,色:ナチュラル(ベージュ)POLYAMIDE(PA),UL94...
2024-12-12794855.65 KB4页91
IC封装资料_电容_0201B102J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123751.05 MB27页91
IC封装资料_电容_CC0402KRX7R8BB332.pdf
IC封装资料_电容_CC0402KRX7R8BB332.pdf
2024-12-12698671.83 KB1页91
IC封装资料_电源管理芯片_LP2985IM5X-3.3_NOPB.pdf
ON/OFFCOUT2.2µFLP2985ON/OFFCBYPASS0.01µFGNDINBYPASSOUTVOUTVINCIN1µFProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSuppo...
2024-12-128741.48 MB36页90
IC封装资料_电感_MLF1608E6R8KTA00.pdf
February2017INDUCTORSFebruary2017MultilayerFerriteMLF16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsMLF1608...
2024-12-12531311.11 KB11页90
IC封装资料_电容_CC0603JRNPO9BN750.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-123431.22 MB13页90
IC封装资料_电容_CC0603JRNPO9BN510.pdf
ProductSpecification–Jul.29,2019V.17DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralpurposeClass1,NP016VTO50V0.22pFto100n...
2024-12-1216331020.87 KB14页90
IC封装资料_电感_LQW18AN18NJ00D.pdf
SpecNo.JELF243A-0024Y-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□00DREFERENCESPECIFICATION1.Scope...
2024-12-121759361.69 KB12页90
IC封装资料_电容_0201X105M6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210891.05 MB27页90
IC封装资料_电容_GCM188R71E104KA57D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1216194.17 MB96页90
IC封装资料_电容_CC0603JRNPO0BN221.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121178998.46 KB11页90
IC封装资料_电感_LQG15HS33NJ02D.pdf
SpecNo.JELF243B-0010S-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12157361.38 KB11页90
IC封装资料_电容_0201CG1R2B250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122531.05 MB27页90
IC封装资料_电容_CC0402KRX7R9BB332.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1297517.81 MB176页90
AL-513OR6C-A_08 (A-BRIGHT).pdf
AAA---BBBRRRIIIGGGHHHTTTA-BRIGHTINDUSTRIALCO.,LTD.PartNo.AL-513OR6CDiffNo.5mmRoundType:LEDLamps2006/9/251Notes:1.Alldimensionsarei...
2024-12-111501312.15 KB5页90
IC封装资料_电源管理芯片_XC6221B122MR-G.pdf
1/28XC6221Series■APPLICATIONS●Smartphones/Mobilephones●Portablegameconsoles●Digitalstillcameras/Camcorders●Digitalaudioequipm...
2024-12-12308545.25 KB28页90
IC封装资料_电容_CL10C111JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12573316.28 KB3页90

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