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IC资料

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IC封装资料_连接器_1843910.pdf
https://www.phoenixcontact.com/pi/products/184391004/09/2019Page1/4Feed-throughheader-MC1,5/14-GF-3,5-1843910Pleasebeinformedthatt...
2024-12-12100218.22 KB4页90
IC封装资料_电容_CL21B224KOCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213801.45 MB36页90
IC封装资料_电容_CC0201KRX7R7BB272.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12638998.46 KB11页90
IC封装资料_电容_CC0201KRX7R8BB103.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121318998.46 KB11页90
IC封装资料_电容_CL10B104KB85PNL.pdf
●Supplier:SamsungElectro-MechanicsCL10B104KB85PNL●Product:Multi-layerCeramicCapacitorCAP,100㎋,50V,±10%,X7R,0603●AEC-Q200Quali...
2024-12-1218065.82 MB36页90
IC封装资料_电容_GRM1555C1H430JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12180920.26 KB29页90
IC封装资料_电容_CL10CR68BB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121471322 KB2页90
IC封装资料_电感_VLS252012T-2R2M1R3.pdf
(1/2)002-02/20080822/e531_vls252012.fm•Allspecificationsaresubjecttochangewithoutnotice.SMDInductors(Coils)ForPowerLine(Wound,Mag...
2024-12-121751130.34 KB2页90
IC封装资料_电阻_VZ067TH1B105.pdf
ProductNameModelNo.ControlNo.DateSalesRepresentativeApprovedApprovedＳＰＥＣＩＦＩＣＡＴＩＯＮHOKURIKUELECTRICINDUSTRYCO.,LTD.Thec...
2024-12-121367248.17 KB13页90
IC封装资料_连接器_1804797.pdf
PC5plugsThenewPC5plugconnectionsystemisthelogicalfurtherdevelopmentoftheclassicPOWERCOMBICONPC4.Withapitchof7.62mmallPC5plugsprovi...
2024-12-121535360.95 KB6页90
IC封装资料_电感_SWPA3012S330MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-122591.32 MB22页90
IC封装资料_电容_0603N101J201CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-124271.26 MB20页90
IC封装资料_电容_0805B181K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127811.05 MB27页90
IC封装资料_电感_SDFL2012LR82KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121110457.75 KB7页90
IC封装资料_电容_CC0805FRNPO9BN102.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121272998.46 KB11页90
IC封装资料_电感_NLV32T-033J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121071325.74 KB6页90
IC封装资料_连接器_1755820.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1236536.13 MB445页90
IC封装资料_电容_0603B331K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-125821.26 MB20页90
IC封装资料_电容_0603B202K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218551.05 MB27页90
IC封装资料_电源管理芯片_LD1117S33CTR.pdf
Thisisinformationonaproductinfullproduction.June2019DocID2572Rev341/4545LD1117AdjustableandfixedlowdroppositivevoltageregulatorDat...
2024-12-1212391.74 MB45页90

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