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IC资料

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IC封装资料_连接器_DF12B_3.0_-10DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121407288.67 KB11页90
IC封装资料_连接器_BM28B0.6-58DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121052562.52 KB8页90
IC封装资料_电容_CL10B473KA8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12928259.58 KB3页90
IC封装资料_连接器_BH1-1204-SBB-G0-TR.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121878251.88 KB1页90
IC封装资料_电源管理芯片_NCP160AMX320TBG.pdf
©SemiconductorComponentsIndustries,LLC,2017March,2020−Rev.171PublicationOrderNumber:NCP160/DLDORegulatorforRFandAnalogCircuits-U...
2024-12-12216914.16 KB21页90
IC封装资料_电容_CL10B223KA8NNWC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12738259.58 KB3页90
IC封装资料_连接器_532611271.pdf
更多资料下载请到五八文库wk.58sms.comDETAILZ注釈NOTE1.コネクタ53261**19の詳細寸法については図面SD-53261-024をご参照ください。REFERT...
2024-12-12475597.48 KB6页90
IC封装资料_连接器_1843910.pdf
https://www.phoenixcontact.com/pi/products/184391004/09/2019Page1/4Feed-throughheader-MC1,5/14-GF-3,5-1843910Pleasebeinformedthatt...
2024-12-12100218.22 KB4页90
IC封装资料_电容_CL21B224KOCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213791.45 MB36页90
IC封装资料_电容_CC0201KRX7R7BB272.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12637998.46 KB11页90
IC封装资料_电容_CC0201KRX7R8BB103.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121317998.46 KB11页90
IC封装资料_电容_CL10B104KB85PNL.pdf
●Supplier:SamsungElectro-MechanicsCL10B104KB85PNL●Product:Multi-layerCeramicCapacitorCAP,100㎋,50V,±10%,X7R,0603●AEC-Q200Quali...
2024-12-1218055.82 MB36页90
IC封装资料_电容_GRM1555C1H430JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12178920.26 KB29页90
IC封装资料_电容_CL10CR68BB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121470322 KB2页90
IC封装资料_电感_VLS252012T-2R2M1R3.pdf
(1/2)002-02/20080822/e531_vls252012.fm•Allspecificationsaresubjecttochangewithoutnotice.SMDInductors(Coils)ForPowerLine(Wound,Mag...
2024-12-121750130.34 KB2页90
IC封装资料_电阻_VZ067TH1B105.pdf
ProductNameModelNo.ControlNo.DateSalesRepresentativeApprovedApprovedＳＰＥＣＩＦＩＣＡＴＩＯＮHOKURIKUELECTRICINDUSTRYCO.,LTD.Thec...
2024-12-121366248.17 KB13页90
IC封装资料_连接器_1804797.pdf
PC5plugsThenewPC5plugconnectionsystemisthelogicalfurtherdevelopmentoftheclassicPOWERCOMBICONPC4.Withapitchof7.62mmallPC5plugsprovi...
2024-12-121535360.95 KB6页90
IC封装资料_电感_SWPA3012S330MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-122571.32 MB22页90
IC封装资料_电容_0603N101J201CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-124261.26 MB20页90
IC封装资料_电容_0805B181K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127801.05 MB27页90

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