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IC资料

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IC封装资料_连接器_KF103-5.0-12P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121485205.01 KB1页85
IC封装资料_连接器_F0502-B-57-20T.pdf
FPC0.50mmConnectorsF0502-B-XX-20T≥24D更多资料下载请到五八文库wk.58sms.com
2024-12-12616290.85 KB1页85
IC封装资料_电感_YPRH105R-471M.pdf
SMDPowerInductors-YPRH105RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12464765.25 KB5页85
IC封装资料_连接器_DF57H-2P-1.2V_21_.pdf
HRSDRAWINGFORREFERENCEMay.1.2018Copyright2018HIROSEELECTRICCO.,LTD.AllRightsReserved.更多资料下载请到五八文库wk.58sms.comHRSDRAWIN...
2024-12-121482514.22 KB3页85
IC封装资料_电容_RVT1V471M1010-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-127671.08 MB3页85
IC封装资料_连接器_DF3A-6P-2DSA.pdf
May.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-121228222.32 KB1页85
IC封装资料_电容_EMVA500ARA471MKG5S.pdf
Productspecificationsinthiscatalogaresubjecttochangewithoutnotice.Requestourproductspecificationsbeforepurchaseand/oruse.Pleaseuse...
2024-12-12795437.44 KB2页85
IC封装资料_连接器_AFC11-S07ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-123751.4 MB10页85
IC封装资料_电容_CC0402KRX7R7BB273.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121164998.46 KB11页85
IC封装资料_电容_CL10B332KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121595452.9 KB21页85
IC封装资料_连接器_AFC01-S32H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-124661.58 MB1页85
IC封装资料_电容_CL10B222KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121930259.58 KB3页85
IC封装资料_电容_GRM1885C1H332JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12475944.07 KB30页85
IC封装资料_连接器_1843855.pdf
https://www.phoenixcontact.com/us/produkte/184385521.12.2012Page1/7Basestrip-MC1,5/8-GF-3,5-1843855Pleasebeinformedthatthedatashow...
2024-12-12214272.09 KB7页85
IC封装资料_电容_CL21C3R3CBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-121187.46 MB84页85
IC封装资料_电容_GRM1555C1HR50BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121259920.26 KB29页85
IC封装资料_电容_CL10B104KA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121401259.58 KB3页85
IC封装资料_电容_0805CG3R3C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129761.05 MB27页85
IC封装资料_接口及驱动芯片_SN74LVC2T45DCU.pdf
B1DIR57A12VCCAVCCBB26A23ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICEattheendofthisdatas...
2024-12-122711.19 MB31页85
IC封装资料_电容_CL10F153ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F153ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121978360.21 KB3页85

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