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IC资料

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IC封装资料_电容_0805CG3R3C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129751.05 MB27页85
IC封装资料_接口及驱动芯片_SN74LVC2T45DCU.pdf
B1DIR57A12VCCAVCCBB26A23ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICEattheendofthisdatas...
2024-12-122711.19 MB31页85
IC封装资料_电容_CL10F153ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F153ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121978360.21 KB3页85
IC封装资料_电容_CL10C680FB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121322259.57 KB3页85
IC封装资料_电容_CL10C471JC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121363259.58 KB3页85
IC封装资料_电容_CL10A474KO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A474KO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-128531.42 MB36页85
IC封装资料_电容_C0603NP0101JGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-125461.92 MB48页85
IC封装资料_电感_SWPA3015S220MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-122041.32 MB22页85
IC封装资料_电源管理芯片_LTC3853EUJ_PBF.pdf
LTC385313853fcFormoreinformationwww.linear.com/LTC3853TYPICALAPPLICATIONFEATURESDESCRIPTIONTripleOutput,MultiphaseSynchronousStep-...
2024-12-121499833.71 KB36页85
IC封装资料_电容_CC1206KKX7RBBB182.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121409998.46 KB11页85
IC封装资料_电源管理芯片_LT3502AEDC_TRPBF.pdf
LT3502/LT3502A13502fdFeaturesapplicationsDescription1.1MHz/2.2MHz,500mAStep-DownRegulatorsin2mm×2mmDFNandMS10TheLT®3502/LT3502Aa...
2024-12-12382543.36 KB24页85
IC封装资料_电感_NLV32T-100J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-12515224.35 KB10页85
IC封装资料_电容_0603B471K101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1213921.26 MB20页85
IC封装资料_电容_CC0805KRX7R9BB821.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1212981.22 MB13页85
IC封装资料_电容_CC0603KRX7R9BB391.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-129117.81 MB176页85
IC封装资料_电容_0402CG9R0D500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218871.05 MB27页85
IC封装资料_连接器_1753657.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comJan31,2011ExtractfromtheonlinecatalogMSTBV2,5/13-GOrderNo.:1753657Thefigures...
2024-12-12885232.34 KB5页85
IC封装资料_电源管理芯片_BQ24735RGRR.pdf
RSRAdapter4.5to24VHOSTbq24735HybridPowerBoostChargeControllerSYSBatteryPackN-FETDriverN-FETDriver1S-4SSMBusSMBusControlsVandIwithh...
2024-12-1215622.48 MB46页85
IC封装资料_电感_LQG15HS9N1J02D.pdf
SpecNo.JELF243B-0010Q-01P.1/11MURATAMFG.CO.,LTDCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.ScopeThisreference...
2024-12-12310359.54 KB11页85
IC封装资料_电容_GCM31ML81C225KA54L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-129464.17 MB96页85

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