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IC封装资料_连接器_1843321.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMCV1,5/12-GF-3,5OrderNo.:1843...
2024-12-12515246.03 KB5页54
IC封装资料_连接器_1829251.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comJan25,2011ExtractfromtheonlinecatalogGMSTBV2,5/12-GF-7,62OrderNo.:1829251The...
2024-12-121182238.36 KB5页54
IC封装资料_电容_CL10B104KO8NNWC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121757259.58 KB3页54
IC封装资料_连接器_0.5K-DX-14PWB.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121787453.69 KB1页54
IC封装资料_电容_GRM155R61A474KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121066920.26 KB29页54
IC封装资料_电容_C0603NP0220JGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-129621.92 MB48页54
IC封装资料_连接器_1757349.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1248436.13 MB445页54
IC封装资料_电容_0805B103J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-121051.26 MB20页54
IC封装资料_电容_0603CG510J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128231.05 MB27页54
IC封装资料_电感_SDCL1005C82NJTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121789376.19 KB4页54
IC封装资料_连接器_1733651.pdf
https://www.phoenixcontact.com/us/produkte/173365119.10.2012Page1/6PCBterminalblock-SMKDSP1,5/10-5,08-1733651Pleasebeinformedthatt...
2024-12-121939177.4 KB6页54
IC封装资料_电源管理芯片_LM1117MP-1.8_NOPB.pdf
ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityReferenceDesignLM1117SNOS412N–FEBRUARY2000–REVISEDJANUAR...
2024-12-126172.74 MB38页54
IC封装资料_电容_0603B224K100CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-122081.26 MB20页54
IC封装资料_电源管理芯片_LM385BD-2.5R2G.pdf
©SemiconductorComponentsIndustries,LLC,2016October,2016−Rev.91PublicationOrderNumber:LM285/DLM285,LM385BMicropowerVoltageReferen...
2024-12-12872178.77 KB9页54
IC封装资料_电容_CL21B822KBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-124647.46 MB84页53
IC封装资料_电容_CC0201CRNPO9BN1R5.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-121111.22 MB13页53
IC封装资料_机械式继电器_G6K-2P-Y.pdf
1G6KG6KSurfaceMountingRelaySurfaceMountingRelaywiththeWorld’sSmallestMountingArea•Subminiaturemodelassmallas5.2(H)×6.5(W)×10(L...
2024-12-1210761.72 MB9页53
IC封装资料_电容_CL10C821JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1213161.39 MB36页53
IC封装资料_电容_CL10C821JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12301259.58 KB3页53
IC封装资料_电容_0805B561K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1212071.26 MB20页53

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