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IC资料

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IC封装资料_电容_GRM1885C2A331JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12915944.07 KB30页50
IC封装资料_电感_YP0301-4R7M.pdf
SMDPowerInductors-YP0301Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12463719.3 KB5页50
IC封装资料_电容_CL21X106KOQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21X106KOQNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-121191.45 MB36页50
IC封装资料_电容_CL10C271JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12529259.58 KB3页49
IC封装资料_电容_TAJE337M006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121963210.32 KB7页49
IC封装资料_电容_04025C471KAT2A.pdf
18GeneralSpecificationsPARTNUMBER(SEEPAGE4FORCOMPLETEPARTNUMBEREXPLANATION)08055СMA2AT103Size(L”xW”)DielectricX7R=CCapacitanceT...
2024-12-12561593.79 KB4页49
IC封装资料_电容_TAJC156K025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121897210.32 KB7页49
IC封装资料_电容_TAJC106M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-1257210.32 KB7页49
IC封装资料_电感_YSPI0750-4R7M.pdf
SMDPowerInductors-YSPI0750Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-12683700.46 KB5页49
IC封装资料_电容_CL10C3R5CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121507259.58 KB3页49
IC封装资料_电容_TAJA475M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12448210.32 KB7页49
IC封装资料_电容_GRM188R71H683KA93D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12603944.07 KB30页49
IC封装资料_连接器_KF103-5.0-11P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121881205.01 KB1页49
IC封装资料_连接器_HB9500-95-4P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12721.21 MB1页49
IC封装资料_电感_YPRH104R-151M.pdf
SMDPowerInductors-YPRH104RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12101762.21 KB4页49
IC封装资料_连接器_DF12B_3.5_-50DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121006288.67 KB11页49
IC封装资料_连接器_BM28B0.6-18DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121478562.52 KB8页49
IC封装资料_电容_CL10B472KA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12117259.58 KB3页49
IC封装资料_连接器_AYF534035.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-1211941.1 MB13页49
IC封装资料_电源管理芯片_SE8533X2-HF.pdf
Rev1.0Preliminaryandallcontentsaresubjecttochangewithoutpriornotice.©SeawardElectronics,Inc.,2006.•www.seawardinc.com.cn•Page1S...
2024-12-12336899.38 KB8页49

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