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IC资料

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IC封装资料_连接器_1843240.pdf
https://www.phoenixcontact.com/us/produkte/184324021.12.2012Page1/5Basestrip-MCV1.5/4-GF-3.5-1843240Pleasebeinformedthatthedatasho...
2024-12-12742187.1 KB5页49
IC封装资料_电容_CL21B224KCFSFNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B224KCFSFNE·Product:Multi-layerCeramicCapacitor...
2024-12-125151.45 MB36页49
IC封装资料_电容_CC0402BRNPO9BN2R0.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1216301.22 MB13页49
IC封装资料_电感_VLCF4020T-2R2N1R7.pdf
INDUCTORSApril2016WoundFerriteVLCF4020InductorsforPowerCircuitsVLCF4020TypeVLCFSeries更多资料下载请到五八文库wk.58sms.com(2/9)INDU...
2024-12-121133195.26 KB9页49
IC封装资料_电感_SWPA252012SR68NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-12631.32 MB22页49
IC封装资料_电阻_CR1210FR050P05R.pdf
CR-SeriesThickFilmChipResistorProductSpecificationsDocumentNo.S-10-12-01-04ReleasedDate2019/03/12PageNo.1/12■■TThhiicckkFFiillmm...
2024-12-1216691.14 MB12页49
IC封装资料_电容_GRM155R60J475ME87D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1292710.43 MB296页49
IC封装资料_电容_CL10A226MR8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12715259.58 KB3页49
IC封装资料_电感_SLF10145T-220M1R9-PF.pdf
INDUCTORSApril2016��SLF10145��SLF10145�SLF��更多资料下载请到五八文库wk.58sms.com(2/9)INDUCTORS20160411/in...
2024-12-121712353.89 KB9页49
IC封装资料_电感_SWPA4030S100MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-129941.32 MB22页49
IC封装资料_电容_0402CG680J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218651.05 MB27页49
IC封装资料_电感_NLV25T-270J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121246316.79 KB6页49
IC封装资料_连接器_1755778.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1213636.13 MB445页49
IC封装资料_电源管理芯片_HX7533 _SOT-89.pdf
HX75XX系列Ver2.00(1/9)系列LDO线性稳压器■产品简介系列是采用CMOS工艺制造，低功耗的高压稳压器，最高输入电压可达18V，输出电压范围为2....
2024-12-121204545.12 KB9页49
IC封装资料_电容_CC0805JRNPO9BN471.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1286717.81 MB176页49
IC封装资料_电源管理芯片_AZ1117CH-ADJTRG1.pdf
AZ1117CDocumentnumber:DS36676Rev.4-21of23www.diodes.comJanuary2019©DiodesIncorporatedAZ1117CLOWDROPOUTLINEARREGULATORDescriptionT...
2024-12-12718910.48 KB23页49
IC封装资料_电感_LQP03TN0N6B02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12368281.03 KB12页49
IC封装资料_电容_GCM155R71H222JA37D.pdf
GCM155R71H222JA37_(0402,X7R:EIA,2200pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121710941.61 KB29页49
IC封装资料_连接器_1754614.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogMSTB2,5/11-GOrderNo.:1754614T...
2024-12-12690229.26 KB5页48
IC封装资料_电容_GCM1555C1H4R0CA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-128645.94 MB73页48

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