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IC资料

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IC封装资料_连接器_SM03B-GHS-TBT.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121970661.12 KB4页185
IC封装资料_三极管_IRFL024ZTRPBF.pdf
IRFL024ZPbFHEXFET®PowerMOSFETVDSS=55VRDS(on)=57.5mΩID=5.1A��www.irf.com1SOT-223ThisHEXFET®PowerMOSFETutilizesthel...
2024-12-121970352.39 KB10页39
IC封装资料_三极管_WSD4062DN56.pdf
SymbolParameterRatingUnitsVDSDrain-SourceVoltage75VVGSGate-SourceVoltage±25VIDContinuousDrainCurrent,VGS=10V,TC=25°C100AContinuo...
2024-12-121970877.99 KB7页267
IC封装资料_电感_NLCV32T-331K-EFD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121969249.79 KB16页262
IC封装资料_电源管理芯片_HX7536 _SOT23-3.pdf
HX75XX系列Ver2.00(1/9)系列LDO线性稳压器■产品简介系列是采用CMOS工艺制造，低功耗的高压稳压器，最高输入电压可达18V，输出电压范围为2....
2024-12-121969545.12 KB9页142
IC封装资料_电容_CC0805FRNPO9BN471.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219691.22 MB13页170
IC封装资料_电容_CC1206JRNPOABN151.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121969998.46 KB11页245
IC封装资料_电源管理芯片_MIC5219-3.3YM5-TR.pdf
DS20006021A-page12018MicrochipTechnologyInc.MIC5219Features•500mAOutputCurrentCapability-SOT23-5Package-500mAPeak-2mmx2mmx0.9mm...
2024-12-1219691.24 MB32页159
IC封装资料_电容_GRM033R60J225ME47D.pdf
IC封装资料_电容_GRM033R60J225ME47D.pdf
2024-12-1219684.66 MB1页256
IC封装资料_电源管理芯片_AZ431AN-ATRE1.pdf
AZ431-ADocumentnumber:DS36721Rev.6-21of19www.diodes.comMarch2018©DiodesIncorporatedAZ431-AADJUSTABLEPRECISIONSHUNTREGULATORSDescr...
2024-12-121968658.87 KB19页97
IC封装资料_电容_CC0805KRX7R0BB221.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219681.22 MB13页23
IC封装资料_电感_NLV25T-R33J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121968316.78 KB6页124
IC封装资料_电容_CL10B102KB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B102KB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121968334.92 KB3页296
IC封装资料_连接器_0.5K-DX-24PWB.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121968453.69 KB1页19
IC封装资料_电容_CL10B104KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1219681.45 MB36页121
IC封装资料_连接器_A2541HWV-2P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121968815.16 KB16页178
IC封装资料_电容_CC0402KRX5R6BB475.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121968998.46 KB11页72
IC封装资料_连接器_BM28B0.6-34DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121968562.52 KB8页23
IC封装资料_电感_YPRH1205-470M.pdf
SMDPowerInductors-YPRH1205Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-121968737.24 KB5页122
IC封装资料_电容_TAJC107K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121968210.32 KB7页261

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