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IC资料

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IC封装资料_连接器_BM28B0.6-34DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121968562.52 KB8页23
IC封装资料_连接器_KF2EDGCV-X-5.08-7P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121968627.15 KB1页174
IC封装资料_电感_YPRH1205-470M.pdf
SMDPowerInductors-YPRH1205Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-121968737.24 KB5页122
IC封装资料_电容_T491D226K025AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1219681.54 MB23页91
IC封装资料_电容_0201B472K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219671.05 MB27页235
IC封装资料_电感_MLF2012DR12JT000.pdf
February2017INDUCTORSFebruary2017积层铁氧体MLF20122012[0805inch]**表示尺寸代码。JIS[EIA]普通电路用电感器MLF2012型MLF系列更多资料下...
2024-12-121967441.85 KB11页182
IC封装资料_连接器_1755736.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12196736.13 MB445页166
IC封装资料_电感_MLK1005S6N8DT000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-121967209.31 KB10页221
IC封装资料_电容_0402CGR75C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219671.05 MB27页145
IC封装资料_电容_GJM1555C1H8R2BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12196710.43 MB296页65
IC封装资料_电容_GRM155R71E333KA88D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121967920.26 KB29页192
IC封装资料_电容_CL21C0R5BBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219671.45 MB36页244
IC封装资料_电容_GCJ188R71H222KA01D.pdf
Lsize1.6±0.1mmWsize0.8±0.1mmTsize0.8±0.1mmExternalterminalwidthe0.2to0.5mmDistancebetweenexternalterminalsg0.5mmmin.Sizecodeini...
2024-12-1219673.23 MB2页93
IC封装资料_电容_CC0402KRX7R9BB223.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219661.22 MB13页61
IC封装资料_电源管理芯片_LT1371CR_TRPBF.pdf
1LT1371500kHzHighEfficiency3ASwitchingRegulatorTheLT®1371isamonolithichighfrequencycurrentmodeswitchingregulator.Itcanbeoperatedi...
2024-12-121966361.84 KB16页248
IC封装资料_电容_0805B104K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1219661.26 MB20页268
IC封装资料_电容_CL10C390GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121966316.18 KB3页57
IC封装资料_电容_CL10B682KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121966452.9 KB21页168
IC封装资料_电容_TAJD687M002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121966210.32 KB7页148
IC封装资料_无线芯片及模块_ESP-07.pdf
ESP-07802.11b/g/nWi-Fi��V1.2Copyright©2017ShenzhenAi-ThinkerTechnologyCo.,LtdAllRightsReserved��2�ESP-07802.11b/g/nWi-Fi...
2024-12-121966325.01 KB2页88

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