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IC资料

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IC封装资料_连接器_1751248.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comJan19,2011ExtractfromtheonlinecatalogMKDS1/2-3,5OrderNo.:1751248Thefiguresho...
2024-12-121636225.16 KB5页20
IC封装资料_电源管理芯片_LT6110HDC_TRMPBF.pdf
LT611016110faFormoreinformationwww.linear.com/LT6110TypicalapplicaTionFeaTuresDescripTionCable/WireDropCompensatorTheLT®6110isapr...
2024-12-121636607.59 KB38页238
IC封装资料_电容_TAJD336K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121636208.62 KB7页75
IC封装资料_电容_CL10C020CB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121636339.99 KB3页225
IC封装资料_电容_TAJA684K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121636210.32 KB7页145
IC封装资料_三极管_DMN2016UTS-13.pdf
DMN2016UTSDocumentnumber:DS31995Rev.1-21of6www.diodes.comDecember2009©DiodesIncorporatedDMN2016UTSNEWPRODUCTDUALN-CHANNELENHANCEM...
2024-12-121635254.54 KB6页261
IC封装资料_电源管理芯片_SE8550X2-HF.pdf
Rev1.0Preliminaryandallcontentsaresubjecttochangewithoutpriornotice.©SeawardElectronics,Inc.,2006.•www.seawardinc.com.cn•Page1S...
2024-12-121635899.38 KB8页102
IC封装资料_电感_YP0705-4R7M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121635721.48 KB5页242
IC封装资料_电源管理芯片_TPS62743YFPR.pdf
IOUT(mA)Efficiency0.0010.010.1110100100050%55%60%65%70%75%80%85%90%95%100%D006VIN=3.6VVIN=4.2VVIN=5.0VVINENVSEL1VSEL2VSEL3SWVOSGND...
2024-12-1216351.48 MB27页224
IC封装资料_电容_0201CG120J250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216351.05 MB27页102
IC封装资料_连接器_281695-8.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121635202.91 KB1页95
IC封装资料_电感_LQW18AN68NG00D.pdf
SpecNo.JELF243A-0024Y-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□00DREFERENCESPECIFICATION1.Scope...
2024-12-121634333.23 KB11页92
AB-9TY-6VD-T10 (A-BRIGHT).pdf
AAA---BBBRRRIIIGGGHHHTTTA-BRIGHTINDUSTRIALCO.,LTD.A-BRIGHT10/30/20061SINGLELAMPLEDBULBDataSheetFeature:HighefficiencyLEDmaterialsa...
2024-12-111634184.89 KB3页261
IC封装资料_电容_CL10B224KA8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B224KA8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1216341.45 MB36页295
IC封装资料_电容_TAJD477M006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121634210.32 KB7页51
IC封装资料_电源管理芯片_TPS43061RTER.pdf
TPS43060/61ISNS-ISNS+VINENPGOODFBAGNDVCCBOOTCOMPRT/CLKSSVINVOUTRSENSELQHQLCICODBOOT(Note1)CBOOTCVCCCSSCCRCRTRSHRSLNote1:DBOOTisreq...
2024-12-1216341.87 MB43页2
IC封装资料_电感_NLV32T-6R8J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121634325.74 KB6页45
IC封装资料_电容_CC0805KRX7R9BB183.pdf
ProductSpecification–June16,2017V.18DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralPurpose&HighCapacitanceClass2,X7R6.3V...
2024-12-1216341.61 MB20页61
IC封装资料_电容_CL21B472KCANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1216337.46 MB84页233
IC封装资料_电感_VLCF5020T-3R3N2R0-1.pdf
INDUCTORSApril2016WoundFerriteVLCF5020-1InductorsforPowerCircuitsVLCF5020-1TypeVLCFSeries更多资料下载请到五八文库wk.58sms.com(2/9)...
2024-12-121633226.65 KB9页186

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