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IC封装资料_电感_MLF1608A1R8JT000.pdf
February2017INDUCTORSFebruary2017MultilayerFerriteMLF16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsMLF1608...
2024-12-121629311.11 KB11页142
IC封装资料_电感_YNR5040-150M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121629666.66 KB5页8
IC封装资料_数据转换器_AD5628BRUZ-2.pdf
Octal,12-/14-/16-Bit,SPIVoltageOutputdenseDACwith5ppm/°C,On-ChipReferenceDataSheetAD5628/AD5648/AD5668Rev.JDocumentFeedbackInform...
2024-12-1216291.04 MB30页15
IC封装资料_电容_CL10B473JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B473JB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121629360.85 KB3页292
IC封装资料_三极管_BCV47.pdf
JIANGSUCHANGJIANGELECTRONICSTECHNOLOGYCO.,LTDSOT-23Plastic-EncapsulateTransistorsBCV47TRANSISTOR(NPN)FEATURESHighCollectorCurren...
2024-12-1216292.03 MB4页263
IC封装资料_电感_YPRH105R-100M.pdf
SMDPowerInductors-YPRH105RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-121628765.25 KB5页90
IC封装资料_电容_CL10B681KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121628259.58 KB3页181
IC封装资料_电容_GRM1885C1H5R6DA01D.pdf
GRM1885C1H5R6DA01_(0603,C0G:EIA,5.6pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121628944.06 KB30页265
IC封装资料_电容_CC0402BRNPO9BN2R0.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1216281.22 MB13页49
IC封装资料_电源管理芯片_LT3519EMS_PBF.pdf
LT3519/LT3519-1/LT3519-213519faTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONLEDDriverwithIntegratedSchottkyDiodeTheLT®3519/LT...
2024-12-121628348.59 KB20页29
IC封装资料_电容_CC1206KRX7R0BB473.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1216281.22 MB13页143
IC封装资料_电容_CL10B152KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B152KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1216271.45 MB36页161
IC封装资料_电感_NLV32T-056J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121627325.74 KB6页288
IC封装资料_电感_NLV32T-470J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121627325.01 KB6页104
IC封装资料_电容_CL10C471JB8NCNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121627259.57 KB3页149
IC封装资料_电容_0805F106M160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216271.05 MB27页132
IC封装资料_三极管_SUD50P10-43L-E3.pdf
VishaySiliconixSUD50P10-43LDocumentNumber:73444S09-1398-Rev.C,20-Jul-09www.vishay.com1P-Channel100-V(D-S)175°CMOSFETFEATURES•Tre...
2024-12-121627238.38 KB9页220
IC封装资料_电容_GRM188R60J106ME47D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121627944.07 KB30页217
IC封装资料_电容_0201CG0R9C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216271.05 MB27页177
IC封装资料_电容_UPW2A100MED.pdf
207ALUMINUMELECTROLYTICCAPACITORSCAT.8100HPerformanceCharacteristicsItemRatedvoltage(V)15MIN4MINφdU1P2W314A5668718M9P10D1112Confi...
2024-12-121627922.93 KB5页243

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