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IC封装资料_电容_0603B103K251NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216011.05 MB27页105
IC封装资料_电源管理芯片_LTC3703EGN-5_PBF.pdf
LTC3703-5137035faAPPLICATIOSUDESCRIPTIOUFEATURESTYPICALAPPLICATIOU■HighVoltageOperation:Upto60V■Large1ΩGateDrivers(with5VSupply...
2024-12-121601460.71 KB32页300
IC封装资料_电感_SWPA6020S2R2NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1216011.32 MB22页173
IC封装资料_连接器_AFC11-S38ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-1216011.4 MB10页134
IC封装资料_电容_GRM188R71H472KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121601944.07 KB30页226
IC封装资料_电容_TAJA155K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121601210.32 KB7页84
IC封装资料_电容_CL10C050CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121601259.58 KB3页39
IC封装资料_电容_CC0603MRX5R5BB226.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1216001.22 MB13页239
IC封装资料_电源管理芯片_LM1117IMPX-5.0_NOPB.pdf
ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityReferenceDesignLM1117SNOS412N–FEBRUARY2000–REVISEDJANUAR...
2024-12-1216002.74 MB38页270
IC封装资料_电容_GRM155R60J155ME80D.pdf
ChipMultilayerCeramicCapacitorsforGeneralPurposeGRM155R60J155ME80_(0402,X5R(EIA),1.5uF,DC6.3V)_:PackagingCodeReferenceSheet■Scope...
2024-12-121600899.99 KB30页136
IC封装资料_电容_CC1206JKNPODBN101.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1215991.22 MB13页230
IC封装资料_电源管理芯片_LT1617ES5_TRPBF.pdf
1LT1617/LT1617-1TYPICALAPPLICATIONUAPPLICATIOSUDESCRIPTIOUFEATURESMicropowerInvertingDC/DCConvertersinSOT-23TheLT®1617/LT1617-1ar...
2024-12-121599226.25 KB8页263
IC封装资料_电容_CL10A475KP8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A475KP8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1215991.42 MB36页280
IC封装资料_电容_CL03C0R5BA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-121599355.35 KB3页283
IC封装资料_电容_GRM1885C1H360GA01D.pdf
GRM1885C1H360GA01_(0603,C0G:EIA,36pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121599944.09 KB30页218
IC封装资料_电源管理芯片_SGM6600-ADJYN6GTR.pdf
SGM660090%EfficientSynchronousStep-UpConverterwith1.2ASwitchGENERALDESCRIPTIONTheSGM6600isa1.2MHz,constantfrequency,currentmode,sy...
2024-12-121599559.51 KB14页149
IC封装资料_电感_YP0705-3R3M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121599721.48 KB5页16
IC封装资料_电容_TMK105BJ104KV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121599857.12 KB55页76
IC封装资料_电容_GRM188R71H123KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121599944.07 KB30页186
IC封装资料_电容_TAJB684K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121598210.32 KB7页31

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