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IC资料

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IC封装资料_电源管理芯片_LT1617ES5_TRPBF.pdf
1LT1617/LT1617-1TYPICALAPPLICATIONUAPPLICATIOSUDESCRIPTIOUFEATURESMicropowerInvertingDC/DCConvertersinSOT-23TheLT®1617/LT1617-1ar...
2024-12-121599226.25 KB8页263
IC封装资料_电容_CL10A475KP8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A475KP8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1215991.42 MB36页280
IC封装资料_电容_CL03C0R5BA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-121599355.35 KB3页283
IC封装资料_电感_NLCV32T-1R0M-EF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121598249.79 KB16页274
IC封装资料_电源管理芯片_LT8471IFE_TRPBF.pdf
LT847118471fdFormoreinformationwww.linear.com/8471TypicalapplicaTionFeaTuresDescripTionDualMultitopologyDC/DCConverterswith2ASwitc...
2024-12-121598557.38 KB36页281
IC封装资料_电容_CL10C470JB8NCNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121598259.58 KB3页273
IC封装资料_电源管理芯片_BQ24195RGER.pdf
VBUSPMIDOTGD+D–STATSDASCLINTCESWBTSTREGNPGNDSYSBATILIMTS1TS2+3.3VHostREGNREGNUSB3.9V–17Vbq24195LPhoneTabletBATTERYQ1CSD25302Q2C5...
2024-12-1215983.74 MB50页113
IC封装资料_电容_UMK105BJ821KV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121598653.27 KB26页70
IC封装资料_连接器_530470810.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121598636.11 KB1页196
IC封装资料_连接器_1803426.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12159836.13 MB445页35
IC封装资料_电容_TAJB684K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121598210.32 KB7页31
IC封装资料_电容_GRM1555C1H1R3BZ01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12159710.43 MB296页65
IC封装资料_电容_T491C106K025AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1215971.54 MB23页187
IC封装资料_电容_TAJC686K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121597210.32 KB7页128
IC封装资料_电容_GRM1885C1H4R0CA01D.pdf
GRM1885C1H4R0CA01_(0603,C0G:EIA,4pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121597944.1 KB30页140
IC封装资料_电容_CL21B102JBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1215977.46 MB84页243
IC封装资料_电容_GCM1885C2A681JA16D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1215974.17 MB96页204
IC封装资料_电容_C822J103J60C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1215972.9 MB5页36
IC封装资料_电容_0603N102J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215971.26 MB20页208
IC封装资料_电容_CL10A225KO5LNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KO5LNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215971.45 MB36页138

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