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IC资料

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IC封装资料_电源管理芯片_LT1585CT-3.45_PBF.pdf
1LT1584/LT1585/LT1587158457aAPPLICATIOSUFEATURESTYPICALAPPLICATIOUDESCRIPTIOU7A,4.6A,3ALowDropoutFastResponsePositiveRegulatorsAdj...
2024-12-121594304.77 KB16页50
IC封装资料_电容_TC212A106M016Y.pdf
SunlordIndustrialPark,DafuyuanIndustrialZone,Guanlan,Shenzhen,China518110Tel:0086-755-29832660Fax:0086-755-82269029E-Mail:sunlord@...
2024-12-121594350.17 KB10页165
IC封装资料_电容_TAJE337K006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121594210.32 KB7页139
IC封装资料_电容_CL10B331KC8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121593259.58 KB3页56
IC资料_IVURDM-QD-803 (BANNER).pdf
DatasheetForusewithiVuRemoteSeriesSensors•89mm(3.5in)diagonalcolorLCDflat-paneltouchscreendisplay•ConnectsdirectlytoaniVuRemoteS...
2024-12-151593453.05 KB3页132
IC封装资料_电容_CL10B122KB8WPNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121593452.9 KB21页66
IC封装资料_电容_CL10C680JC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121593259.58 KB3页80
IC封装资料_电容_0603CG110J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215931.05 MB27页164
IC封装资料_电感_MLK1005S2N7ST000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-121593209.31 KB10页7
IC封装资料_电源管理芯片_LTC4210-1CS6_TRPBF.pdf
LTC4210-1/LTC4210-21421012faFormoreinformationwww.linear.com/LTC4210-1TYPICALAPPLICATIONFEATURESDESCRIPTIONHotSwapControllerin6-Le...
2024-12-121592574.87 KB22页101
IC封装资料_电容_0603N151J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215921.26 MB20页19
IC封装资料_电源管理芯片_RS3002-3_3YE3.pdf
RS3002REVA.41www.run-ic.com150mA,UltralowPowerConsumption,HighVoltageCMOSLDORegulatorFEATURES•UltralowQuiescentCurrentIQ:2.5µATy...
2024-12-121592660.04 KB15页190
IC封装资料_连接器_AYF530635.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-1215921.1 MB13页88
IC封装资料_电容_GRM188R72A331KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121592944.07 KB30页95
IC封装资料_连接器_1726176.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comJan18,2011ExtractfromtheonlinecatalogMKKDSN1,5/5-5,08OrderNo.:1726176Theillu...
2024-12-121592237.81 KB5页192
IC封装资料_连接器_0.5K-DX-50PWB.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121591453.69 KB1页51
IC封装资料_电容_CL10C470JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1215911.39 MB36页80
IC封装资料_电源管理芯片_LM285D-2.5R2G.pdf
©SemiconductorComponentsIndustries,LLC,2016October,2016−Rev.91PublicationOrderNumber:LM285/DLM285,LM385BMicropowerVoltageReferen...
2024-12-121591178.77 KB9页221
IC封装资料_电源管理芯片_LTC4415EMSE_TRPBF.pdf
LTC441514415faTypicalapplicaTionFeaTuresDescripTionDual4AIdealDiodeswithAdjustableCurrentLimitTheLTC®4415containstwomonolithicPow...
2024-12-121590435.08 KB20页298
IC封装资料_电容_C1608X7R1H473M080AE.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC1005[0402inch]C1608[0603...
2024-12-121590649.63 KB18页254

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