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IC封装资料_电源管理芯片_LTC4217CDHC_TRPBF.pdf
LTC421714217fgFormoreinformationwww.linear.com/LTC4217TypicalapplicaTionFeaTuresapplicaTionsDescripTion2AIntegratedHotSwapControll...
2024-12-121585351.49 KB20页66
IC封装资料_连接器_87832-1420.pdf
RELEASESTATUSP1RELEASEDATE2018/07/3100:10:18GENERALTOLERANCES(UNLESSSPECIFIED)MMINCH4PLACES±±3PLACES±±2PLACES±0.2±1PLACES±...
2024-12-1215851.02 MB12页52
IC封装资料_电容_CL10C240JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121585316.26 KB3页25
IC封装资料_连接器_DF12C_3.0_-36DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121585288.67 KB11页163
IC封装资料_电容_TAJB225K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121584210.32 KB7页143
IC封装资料_电容_CL21B105KPFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1215841.46 MB36页224
IC封装资料_电源管理芯片_LT1761ES5-BYP_TRPBF.pdf
LT1761Series11761sffTYPICALAPPLICATIONDESCRIPTION100mA,LowNoise,LDOMicropowerRegulatorsinTSOT-23TheLT®1761seriesaremicropower,low...
2024-12-1215841.21 MB22页19
IC封装资料_电源管理芯片_LT1021DCS8-10_PBF.pdf
1LT10211021fcAPPLICATIOSUFEATURESTYPICALAPPLICATIOUDESCRIPTIOUPrecisionReferenceTypicalDistributionofTemperatureDriftOUTPUTDRIFT(p...
2024-12-121584306.35 KB16页114
IC封装资料_电容_C323A103J60C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1215834.24 MB7页263
IC封装资料_电容_TAJE156M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121583210.32 KB7页92
IC封装资料_电容_GCJ216R71H223KA01D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1215834.17 MB96页167
IC封装资料_电感_MLF1608E5R6KTA00.pdf
February2017INDUCTORSFebruary2017MultilayerFerriteMLF16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsMLF1608...
2024-12-121583311.11 KB11页173
IC封装资料_电源管理芯片_AP1534SG-13.pdf
AP1534PWMCONTROL2ASTEP-DOWNCONVERTERAP1534Documentnumber:DS31314Rev.6-21of9www.diodes.comApril2011©DiodesIncorporatedDescriptionA...
2024-12-121583291.37 KB9页40
IC封装资料_电容_0201CG5R0B500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215831.05 MB27页211
IC封装资料_电容_UCS2W470MHD1TN.pdf
252ALUMINUMELECTROLYTICCAPACITORSCAT.8100HUCSMiniatureSized,HighRippleCurrent,HighReliabilityHighripplecurrentandLongLifeproductwi...
2024-12-121582781.44 KB2页120
IC封装资料_电容_CL21B102KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215821.45 MB36页182
IC封装资料_电容_GRM155R71C183KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121582920.26 KB29页153
IC封装资料_晶体管_ULN2003AN.pdf
7C6C5C4C3C2C1CCOM76543217B6B5B4B3B2B1B101112131415169ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMP...
2024-12-1215821.39 MB35页223
IC封装资料_电容_GRM1555C1H4R0BA01D.pdf
GRM1555C1H4R0BA01_(0402,C0G:EIA,4pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121582944.29 KB30页232
IC封装资料_电容_CC0402JRNPO0BN100.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1215811.22 MB13页61

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