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IC资料

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IC封装资料_电容_CL32A106KBJNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL32A106KBJNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-121527421.39 KB3页218
IC封装资料_电容_C322C474K90C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1215264.24 MB7页288
IC封装资料_连接器_F0502-B-08-20T.pdf
FPC0.50mmConnectorsF0502-B-XX-20T≥24D更多资料下载请到五八文库wk.58sms.com
2024-12-121526290.85 KB1页250
IC资料_Q12RN6FF30Q3 (BANNER).pdf
DatasheetMiniatureself-containedphotoelectricsensorsinuniversalhousing•Bright,visiblered(640nm)lightsource•Standardmodelsavailab...
2024-12-151526538.21 KB8页190
IC封装资料_电容_GRM1555C1HR20BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121526920.26 KB29页126
IC封装资料_电容_CC0201CRNPO9BN4R7.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1215261.22 MB13页70
IC封装资料_连接器_1758157.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12152636.13 MB445页140
IC封装资料_电容_0603F103M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215261.05 MB27页130
IC封装资料_电感_SWPA4030S1R8NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1215261.32 MB22页128
IC封装资料_电源管理芯片_LM4040B50FTA.pdf
LM4040Documentnumber:DS33195Rev.7-21of12www.diodes.comFebruary2017©DiodesIncorporatedLM4040PRECISIONMICROPOWERSHUNTVOLTAGEREFEREN...
2024-12-121526600.24 KB12页222
IC封装资料_连接器_1830677.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12152536.13 MB445页28
IC封装资料_电源管理芯片_LT3517EUF_PBF.pdf
LT351713517fhFormoreinformationwww.linear.com/LT3517FeaturesapplicationsDescriptionFull-FeaturedLEDDriverwith1.5ASwitchCurrentTheL...
2024-12-121525485.52 KB20页141
IC封装资料_电容_BFC233820103.pdf
MKP3382X2www.vishay.comVishayBCcomponentsRevision:21-Sep-161DocumentNumber:28119Fortechnicalquestions,contact:rfi@vishay.comTHISDO...
2024-12-121525262.13 KB16页158
IC封装资料_电容_TAJC227M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121525210.32 KB7页48
IC封装资料_连接器_DF13E-30DP-1.25V.pdf
HRSDRAWINGFORREFERENCEMay.1.2018Copyright2018HIROSEELECTRICCO.,LTD.AllRightsReserved.更多资料下载请到五八文库wk.58sms.comHRSDRAWIN...
2024-12-121525264.15 KB2页54
IC封装资料_连接器_DF12B-30DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121525288.67 KB11页226
IC封装资料_连接器_AFC11-S05ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-1215251.4 MB10页51
IC封装资料_电容_0805N470J501CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215251.26 MB20页291
IC封装资料_电容_CL10B223MB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B223MB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121525360.81 KB3页230
IC封装资料_电容_GRM155R71H393KE14D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121525920.26 KB29页227

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