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IC封装资料_接口及驱动芯片_MAX3232ECD.pdf
RXTXPOWER3.3V,5VDINROUTDOUTRS232RINRS2322222ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTIC...
2024-12-1215212.43 MB29页28
IC封装资料_电容_0603N222J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215211.26 MB20页86
IC封装资料_三极管_DTC143ZETL.pdf
DTC143ZseriesNPN100mA50VDigitalTransistors(BiasResistorBuilt-inTransistors)DatasheetllOutlineParameterValueVMT3EMT3FVCC50VIC(MAX.)...
2024-12-1215213.77 MB12页140
IC封装资料_电容_TAJB155M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121521210.32 KB7页46
IC封装资料_电容_GRM188R71H682KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121521944.07 KB30页32
IC封装资料_电源管理芯片_REF3130AIDBZR.pdf
120100806040200DropoutVoltage(mV)�15�10�5051015LoadCurrent(mA)ADS7822VCCCSDOUTDCLOCKVREF+In�InGND++5�1Fto10F��1Fto�10F�3....
2024-12-1215211.33 MB28页165
IC封装资料_电感_YNR6045-680M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121520672.55 KB6页86
IC封装资料_电容_CC0603JRNPO0BN560.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121520998.46 KB11页242
IC封装资料_电容_CL10C560JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1215201.39 MB36页99
IC封装资料_电感_SWPA4030S4R7MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1215201.32 MB22页182
IC封装资料_电容_CL21B475KOFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B475KOFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1215191.49 MB36页94
IC封装资料_电容_GRM1885C1H2R0BA01D.pdf
GRM1885C1H2R0BA01_(0603,C0G:EIA,2pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121519944.09 KB30页276
IC封装资料_电容_CL10C221KD8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121519353.15 KB3页221
IC封装资料_三极管_IRLR7843TRPBF.pdf
www.irf.com104/30/08IRLR7843PbFIRLU7843PbFHEXFET��PowerMOSFETNotes��through�areonpage11ApplicationsBenefits�VeryLowRDS(on)...
2024-12-121519454.95 KB11页35
IC封装资料_电容_EGN2GM3R3F12OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12151915.39 MB230页106
IC封装资料_电容_CL10B154KA8SFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B154KA8SFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215191.45 MB36页178
IC封装资料_电源管理芯片_173010542.pdf
WPMDH1100xx1S/173010x42MagI3CPowerModuleFDSM–FixedStepDownRegulatorModulewe-online.comWürthElektronikeiSosGmbH&Co.KG–DataSheetR...
2024-12-1215191.75 MB24页52
IC封装资料_电感_LQG15HN4N7S02D.pdf
SpecNo.JELF243B-0009T-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121519273.56 KB11页83
IC资料_CL50XRXAOS3NQ (BANNER).pdf
DatasheetMulti-ColorGeneralPurposeorAudibleIndicators•Rugged,cost-effective,andeasy-to-installmulti-colorindicators•Illumination...
2024-12-1515181 MB6页52
IC封装资料_连接器_1830693.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12151836.13 MB445页237

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